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Posted: February 25, 2008

Rohm and Haas in Nanotechnology Project With IBM

(Nanowerk News) Rohm and Haas Electronic Materials (NYSE:ROH), a leading supplier of advanced lithography materials for the semiconductor industry, has entered into a joint development agreement with IBM to create patterning materials and processes to enable implant at and below the 32 nm node.
The focus of the agreement is a joint collaboration to develop total implant solutions for advanced technology nodes. Ion implantation is a set of critical process steps to fabricate various types of transistors, which are the heart of semiconductor devices. The implant process selectively introduces electrical charges into extremely small areas that have been defined by preceding lithographic steps.
At 32 nm and below, implant lithography has become critical, but poses a major technology hurdle. As semiconductor designs continue to shrink, significant new challenges emerge in controlling implants used in the formation of transistors. It is anticipated that approximately 40 percent of photo levels in advanced logic designs will be implant.
“Finding the right solutions to difficult technical challenges for the next-generation nodes depends not only on strong engineering and design but also close collaboration with leaders in the semiconductor industry,” said Dr. James Fahey, president of Microelectronic Technologies for Rohm and Haas Electronic Materials. “Partnering with IBM will accelerate the development of new materials and ensure that we are on track to meet the needs for 32 and 22 nm nodes.”
“We are proud to be working with Rohm and Haas Electronic Materials, combining IBM’s continued development of lithography solutions with Rohm and Haas’s material expertise,” said George Gomba, Distinguished Engineer and Director of Total Patterning Solutions for IBM Microelectronics. “There are many options for lithography at 32nm and beyond, and this relationship will help to create solutions for these unique challenges.”
Work on the joint collaboration will take place at IBM’s East Fishkill, Yorktown and Albany facilities and at Rohm and Haas Electronic Materials’ Advanced Technology Center in Marlborough, MA, where completion of its new ultra-high NA 193 nm immersion cluster is expected by June 2008.
About Rohm and Haas Company
Leading the way since 1909, Rohm and Haas is a global pioneer in the creation and development of innovative technologies and solutions for the specialty materials industry. The company’s technologies are found in a wide range of markets including: Building and Construction, Electronics, Food and Retail, Household and Personal Care, Industrial Process, Packaging, Paper, Transportation and Water. Our innovative technologies and solutions help to improve life everyday, around the world. Based in Philadelphia, PA, the company generated annual sales of approximately $8.9 billion in 2007. Visit www.rohmhaas.com for more information. imagine the possibilities™
About Rohm and Haas Electronic Materials
Rohm and Haas Electronic Materials develops and delivers innovative material solutions and processes to the electronic and optoelectronic industries. Focused on the circuit board, semiconductor manufacturing, advanced packaging, and flat panel display industries, its products and technologies are integral elements in electronic devices around the world.
Source: Rohm and Haas
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