| Posted: April 1, 2008 |
Sematech to host forum on future chip-making process |
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(Nanowerk News) In 2006, SEMATECH held a gathering of industry experts to discuss lithography technology options for 2009 and beyond. That forum clearly showed the industry consensus to use 193nm immersion lithography for 45nm half-pitch, and focused the industry on choices for future technology nodes.
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Now, as the industry addresses the challenges of the lithography roadmap for 32nm half-pitch and beyond, the question of introducing an alternative to 193nm optical lithography again comes to the forefront.
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How far can an immersion lithography solution be extended, especially with the significant increase in interest in multiple exposure techniques?
When will Extreme Ultraviolet Lithography (EUVL) be ready for manufacturing insertion?
Are there other options that should not be overlooked, such as nano-imprint lithography, maskless lithography, or chemical extensions such as directed self-assembly?
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Given the rising costs and decreasing funding for R&D, the industry needs a critical and objective assessment of all of the options.
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The purpose of the SEMATECH Litho Forum is to provide fair and balanced assessments of the readiness of leading lithography technologies, and focus on the best solutions for bringing them into manufacturing when needed.
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The resulting information will be invaluable in determining whether to extend current technologies, narrowing the industry's options for promising alternatives, and building infrastructure for emerging technologies.
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Make your plans now to be a part of this important forum to help build industry consensus and gain valuable information to help formulate your company's own technology strategies.
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When: May 12-14 , 2008
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Where: Bolton Landing (Lake George), NY
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More info: http://www.sematech.org/meetings/announcements/8352/
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