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Posted: July 8, 2008
SUSS MicroTec Delivers Coat/Develop Cluster to Replisaurus Technologies
(Nanowerk News) SUSS MicroTec, supplier of innovative solutions for the 3D, MEMS, Advanced Packaging and Nanotechnology markets, announced today that it has shipped and successfully installed a Gamma coating cluster at Replisaurus Technologies, a provider of a revolutionary metallization technology called “ElectroChemical Pattern Replication” (ECPR™), which offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. The modular coat/bake/develop cluster from SUSS represents the latest generation technology in high volume production spin coating. Gamma systems are designed to maximize performance at the lowest cost of ownership, while delivering consistently uniform results for a variety of applications such as thin and thick resists, BCB, dielectrics or high topographies.
Replisaurus will use the Gamma for applications related to its proprietary ECPR™ process, a fab-friendly, environmentally-clean metallization process technology, which has extremely fast plating rates. The ECPRÔ process combines the precision and resolution of advanced lithography with the ease and efficiency of electrochemical deposition into one single integrated process solution. ECPR™ is targeted at key growth markets such as integrated passives, copper pillars and 3D integration.
"Replisaurus chose SUSS MicroTec to support us with superior coater and developer technology as SUSS is clearly the leader in this market. The SUSS Gamma system meets our high performance requirements by delivering consistently uniform results for a variety of challenging materials, said James Quinn, CEO of Replisaurus Technologies. “Replisaurus has been devoted to developing production processes for the Advanced Packaging and 3D integration market", commented Rolf Wolf, general manager of SUSS MicroTec Lithography Division. “We are excited to support their enabling technology with our Gamma system.”
About Replisaurus Technologies
Replisaurus Technologies, Inc. has developed a revolutionary metallization technology targeted at key growth markets such as integrated passives, copper pillars and 3D integration (TSV). The “ElectroChemical Pattern Replication” (ECPR™) process offers a simple and cost effective integrated solution eliminating several traditional process steps thereby reducing complexity. ECPR™ is a fab friendly, environmentally clean process which does not use any solvents, developers or strippers and has extremely fast plating rates. The ECPR™ technology is a “Design Enabling” technology for integrated passives enabling advanced designs, eliminating the need for prototyping and dummy plating patterns. The electrochemical replication principle of ECPR™ combines the precision and resolution of advanced lithography with the ease and efficiency of electrochemical deposition into one single integrated process solution.
For more information please visit us at www.replisaurus.com.
About SUSS MicroTec
SUSS MicroTec, listed in Deutsche Borse AG’s Prime Standard, is one of the world’s leading suppliers of process and testing solutions for markets such as advanced packaging, MEMS, nanotechnology, compound semiconductor, Silicon-On-Insulator and 3D Interconnect. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions.
SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service.
Headquartered in Garching near Munich, Germany, SUSS MicroTec employs more than 730 employees worldwide.