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Posted: October 13, 2008
EV Group Ships 100th Nanoimprint Lithography System
(Nanowerk News) EV Group (EVG), a leading
supplier of wafer bonding and lithography equipment for the MEMS,
nanotechnology and semiconductor markets, today announced it has shipped its
100th nanoimprint lithography (NIL) system. The milestone shipment is
significant not only for EVG -- which holds an approximate 30-percent share of
market with the most NIL systems in the field -- but also for the industry
overall, as it serves to highlight the significant growth of the global NIL
installed base, which has more than doubled over the past four years.
"Nanoimprint lithography is an enabling technology for optical and
microfluidic applications," noted Paul Lindner, executive technology director
for EV Group. "With EVG's firm commitment to NIL development and
commercialization, together with our industry-leading NIL products, including
our EVG770 fully-automated NIL Stepper and EVG750 fully-automated Hot
Embossing systems, we remain well positioned to benefit as these and other
markets such as chemical and biosensor move into high-volume production."
EVG's 100th NIL system shipment further underscores the ongoing drive to
broaden adoption of NIL processes. As a leading proponent of this effort, EVG
founded the NILCOM Consortium in 2004. The mission of the consortium, whose
dozen members span equipment, materials, processes and research, is to
establish a high-volume NIL manufacturing platform that can be commercially
deployed within a wide range of technology arenas, including nanoelectronics,
optoelectronics, data storage and life sciences.
Recent successes in these areas have included NIL processes being used
commercially in the optics market for CMOS image sensors, optical gratings and
LEDs as well as commitment from the hard disk drive (HDD) market to employ NIL
for their roadmaps in discrete track recording (DTR) and bit pattern media
(BPM). These approaches are expected to be implemented in future generations
of HDD products to enable data storage densities in excess of 10^12 bits/in^2.
EVG will present its new working stamp technology for UV-based imprint
lithography applications at the 7th annual International Conference on
Nanoimprint and Nanoprint Technology (NNT), which will be held October 13-15,
2008 at the Kyoto International Conference Center in Kyoto, Japan.
About EV Group
EV Group (EVG) is a world leader in wafer-processing solutions for
semiconductor, MEMS and nanotechnology applications. Through close
collaboration with its global customers, the company implements its flexible
manufacturing model to develop reliable, high-quality, low-cost-of-ownership
systems that are easily integrated into customers' fab lines. Key products
include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology
equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG
holds a leading position in NIL and lithography for advanced packaging and
MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006
to create and help drive implementation of a cost-effective through-silicon
via (TSV) process for major ICs and MEMS/sensors. Other target
semiconductor-related markets include silicon-on-insulator (SOI), compound
semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and
operates via a global customer support network, with subsidiaries in Tempe,
AZ; Albany, NY; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li,
Taiwan. The company's unique Triple i-approach (invent - innovate -
implement) is supported by a vertical integration, allowing EVG to respond
quickly to new technology developments, apply the technology to manufacturing
challenges and expedite device manufacturing in high volume. More information
is available at http://www.EVGroup.com.