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Posted: January 15, 2009
Major Power Management Components Maker Purchases Tegal Endeavor AT PVD System Upgrade
(Nanowerk News) Tegal Corporation, a leading designer and manufacturer of plasma etch and deposition systems used in the production of power semiconductor, MEMS, and optoelectronic devices, announced today that the Company received an order for an Endeavor AT PVD cluster tool upgrade from a leading global manufacturer of power management components for the communications, consumer electronics, and industrial markets. The Endeavor AT PVD system upgrade will ship in the first quarter of CY2009, and will be used by Tegal’s customer to expand the suite of thin silicon wafer backside metallization applications now running in volume production at the customer’s domestic, ISO-certified wafer fab.
“Our customer’s successful production experience with the superior wafer handling, film adhesion, and film eutectic creation capabilities of the Endeavor AT PVD system on thin wafer backside metallization applications resulted in this tool upgrade order, and we are pleased to have earned this repeat business,” said Paul Werbaneth, Vice President - Marketing, Tegal Corporation. “Once their Endeavor AT tool was released into volume production, our customer saw demonstrable commercial advantages resulting from the S-Gun PVD processes running on the Endeavor AT, and, as a result, have now decided to upgrade their Endeavor tool in order to expand the process and production capabilities of the system.”
The Tegal Endeavor AT system is a state-of the-art, ultra-high vacuum PVD cluster tool used in production fabs to deposit consistent, high purity films, with low to zero stress values, in an extremely clean process environment. Low stress films are widely utilized in backside metallization for power and discrete devices, under-bump metallization applications, advanced packaging, high-brightness light emitting diodes (HB-LEDs), and in creating electro-acoustic devices for BAW, FBAR, and RF MEMS applications. The Endeavor AT has an easy-to-use GUI, SECS/GEM communication, reliable low-contact wafer handling, and flexible wafer shape and size capability, that make the Endeavor tool ideal for ultra-clean production environments for both front-side and back-side applications. Optional damage-free soft-etch modules, and a variety of DC, AC, and RF magnetron configurations, are available to sputter the many different dielectric and conductive films used in semiconductor, MEMS, and other electronic device production.
Tegal sells production-qualified process tools for commercial fabrication of power semiconductor, MEMS, and optoelectronic devices. Incorporating unique, patented, etch and deposition technologies, our installed base of more than 1,700 etch and deposition systems is backed by 35+ years of continuous technology improvements, and over 100 patents. We’ve earned a reputation among our customers for award-winning support, and for supplying reliable, value-oriented systems, for Silicon DRIE MEMS and Power Device etch, AlN PVD and PZT plasma etch, precision descum, and stress-controlled metal film PVD. Some examples of products enabled by Tegal technology are power management modules found in portable computers, cellphones, and handheld consumer electronic gear; megapixel imaging chips used in digital and cellphone cameras; power amplifiers for portable handsets and wireless networking; and MEMS devices like accelerometers for consumer electronics, gaming, and automotive safety and stability control, microfluidic control devices for ink jet printers; and laboratory-on-a-chip medical test kits.
For more information about Tegal Corporation, please visit: www.tegal.com.