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Posted: March 3, 2009
Bosch Selects Lam Research Corporation's MEMS Etch System for Current and Next-generation Manufacturing
(Nanowerk News) Lam Research Corporation, a major supplier of semiconductor wafer fabrication equipment and services, today announced selection of its TCP 9400DSiE deep silicon etch system by Robert Bosch GmbH. Bosch is the world’s leading MEMS (micro-electromechanical systems) sensor manufacturer, specializing in automotive sensors and consumer devices.
“The Bosch name is synonymous in the industry with deep silicon etch technology, so we are extremely pleased our TCP 9400DSiE etch system has been qualified by Bosch,” said Marshall Benham, MEMS product line head at Lam Research. “This decision signals the need for production-proven solutions in growing MEMS segments that are transitioning to volume manufacturing. These customers expect the highest degree of technology embedded on manufacturing-worthy platforms.”
The TCP 9400DSiE system is based on Lam’s production-proven TCP 9400 silicon etch series with more than 1,500 chambers installed worldwide. The system’s patented high-density TCP plasma source provides an ideal configuration to meet the challenges of silicon deep reactive ion etch, offering broad process capability and flexibility for a wide range of MEMS, advanced packaging, and power semiconductor applications. Optimized source and chamber hardware deliver excellent profile control, cross-wafer symmetry, and repeatability, which are important for ensuring high yield in MEMS devices. Incorporation of Lam’s proprietary in situ chamber cleaning technology enables excellent etch rate stability and high uptime. These proven capabilities help MEMS manufacturers ramp new applications quickly to high-volume production.