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Posted: March 31, 2009
Tessera Licenses OptiML Wafer-Level Optics to Qtech
(Nanowerk News) Tessera Technologies, Inc. announced today that Q Technology Limited (Qtech) has licensed Tessera’s OptiML™ wafer-level optics (WLO) technology for next-generation mobile electronics. Qtech, based in China, will integrate the technology into its compact modules for cell phone and notebook computer applications.
Consumers continue to demand smaller, increasingly feature-rich products. Tessera’s OptiML WLO technology enables manufacturers to significantly advance the integration of miniaturized cameras in cell phones, personal computers, security cameras and other portable devices. The combination of Tessera’s OptiML WLO technology, the company’s SHELLCASE image sensor wafer-level packaging solution and Qtech’s camera module assembly know-how, will enable Qtech to manufacture high-quality, low-cost, reflowable VGA cameras.
“Qtech shares Tessera’s vision that the industry is moving toward camera module technology that is developed at the wafer level,” said Michael Bereziuk, executive vice president, Imaging & Optics, Tessera. “Qtech’s decision to license our OptiML wafer-level optics technology, as well as our SHELLCASE MVP image sensor packaging solution (Tessera Licenses SHELLCASE MVP Technology to Qtech; Nov. 11, 2008), demonstrates its commitment to providing handset manufacturers with the most advanced camera module technology currently available.”
“Tessera continues to lead the marketplace in wafer-level optics technology by enabling us to compete effectively in the global consumer electronics market,” said Dr. Hao Zhou, CEO, Qtech. “By extending the technology we license from Tessera, we are able to further our efforts to provide the best wafer-level optics solution available today.”
OptiML WLO technology is available for licensing from Tessera now.
OptiML Wafer-Level Optics
Tessera OptiML wafer-level optics (WLO) enables the design and manufacture of miniaturized optics at the wafer level using advanced semiconductor-like techniques. The end product is cost effective, miniaturized optics that enable the reduced form factor of camera modules for mobile devices. The technology is scalable from a single-element CIF/VGA lens to a multi-element megapixel lens structure, where the lens wafers are precision aligned, bonded together and diced to form multi-element lens stacks. Coupled with SHELLCASE MVP wafer level package (WLP) solution for image sensors, WLO enables a small, cost effective camera module that successfully competes with conventional camera modules by providing better value.