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Posted: May 04, 2013
Rudolph Technologies Launches S3000SX Transparent Thin Film Metrology System for 28nm Node and Below
(Nanowerk News) Rudolph Technologies, Inc., a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, announced the release of the S3000SX™ thin film metrology system for transparent films in advanced semiconductor fabrication applications at the 28nm node and below. This latest addition to the S3000 product family uses Rudolph’s proprietary focused beam ellipsometry (FBE) and newly-designed small site measurement optics (SSMO) to measure the thickness of single layer and multi-layer films on product wafers including device area at sites sizes as small as 30x30 µm. Additionally, the S3000SX System continues Rudolph’s flexible modular approach with a selection of new metrology capabilities that customers can tailor to their specific process requirements, optimizing the balance of performance and cost of ownership.
“Each node pushes the limits of semiconductor manufacturing processes and the control needed to maintain yield,” said Dr. Mike Colgan, vice president and general manager of Rudolph’s Metrology Business Unit. “Scaling to the 2x and 1x nodes continues to introduce novel materials, thinner multilayer film stacks, and the need for fast, accurate, on-product metrology. With its small site measurement capability and an array of unique metrology and productivity solutions, the S3000SX System offers the optimal combination of high performance and low cost of ownership for fab-wide metrology in logic, memory, foundry, and MEMS.”
Rudolph’s proprietary FBE uses three laser sources operating at different wavelengths to measure film thicknesses with industry-leading speed and precision without the need for complicated dispersion models. The laser’s stability and accuracy permit easy matching between systems and its long lifetime minimizes downtime for maintenance. The S3000SX System adds a new shorter wavelength source (405 nm) and specialized small site measurement optics to permit single wavelength measurements in sites as small as 30X30 µm, and provides improved performance on SOI, thin films and SiGe. Available metrology options include deep UV (190 nm) reflectometry, wafer stress and bow measurements, and next-generation airborne molecular contaminant control.
About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com
Source: Rudolph Technologies (press release)
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