Toshiba Launches New Embedded NAND Flash Memory Modules Featuring 19nm Second Generation Process Technology
(Nanowerk News) Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of its new embedded NAND flash memory modules. The new modules integrate NAND chips fabricated with Toshiba's 19nm second generation process technology and are fully compliant with the latest e-MMCTM standard. Designed for application in a wide range of digital consumer products, the new modules are targeted to smartphones, tablet PCs and digital video cameras.
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products.
The company's new 32-gigabyte (GB) embedded device integrates four 64-Gigabit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 19nm second generation process technology and a dedicated controller into a small package measuring only 11.5 x 13 x 1.0mm. It is compliant with JEDEC e-MMC Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.
Toshiba's new line-up of single-package embedded NAND flash memories includes densities from 4GB to 128GB. Each device integrates a controller to manage basic control functions for NAND applications.
Mass production will begin at the end of November 2013, with additional densities (including 4GB, 8GB, 64GB and 128GB products) to follow.
The JEDECe-MMC V5.0 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
Embedded in a system, the 128GB module can record up to 2,222 hours of music at a 128Kbps bit rate, 16.6 hours of full spec high definition video and 38.4 hours of standard definition video.
The new products apply NAND flash memory chips fabricated with Toshiba's leading-edge 19nm second generation process technology.
The new products are sealed in a small FBGA package measuring just 11.5 x 13mm, and have a signal layout compliant with the JEDECe-MMC V5.0.
For additional company and product information, please visit http://www.toshiba.com/taec/ or http://www.toshiba.com/taec/adinfo/technologymoves.
 e-MMC is a trademark and a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification. Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. Maximum read and write speed may vary depending on the host device, read and write conditions, and file size. For purposes of measuring read and write speed in this context, 1 megabyte or MB = 1,000,000 bytes. HD and SD are calculated at average bit rates of 17Mbps and 7Mbps, respectively. Read and write speed may vary depending on the read and write conditions, such as devices you use and file sizes you read and/or write. (For purposes of measuring data transfer and read-write speed in this context, 1 MB = 1,000,000 bytes).