JPK Instruments recently hosted their tenth annual international symposium on the applications of scanning probe microscopy (SPM) and optical tweezers. Held this month in the historic Umspannwerk Ost in Berlin, the meeting brought together more than 100 scientists from around the world.
Beneq has today been presented with the Millennium Distinction Award, an accolade presented by Technology Academy Finland (TAF) to Finnish scientists and growth companies for outstanding technological achievements in the field of the most recent Millennium Technology Prize Winner.
With the FRITSCH Laser Particle Sizers ANALYSETTE 22 MicroTec plus and NanoTec plus particle measurement becomes a simple matter, for professionals as well as for any employee - in production and quality control or in research and development.
Fractal Antenna Systems, Inc. today disclosed a patent filing for a novel approach to better wireless antennas. Called 'Fractal Plasmonic Surfaces', the new antenna technology promises to provide wideband ability at low cost along with other unique features.
QuantuMDx Group Limited, a handheld diagnostics and sequencing company, today announced that it has signed an exclusive license agreement with Nanosys Inc., an advanced materials architect, for several patents and patent applications related to the use of nanostructures for biosensors.
CETR, a privately held tribology and mechanical testing company headquartered in Campbell, CA, with 30 employees, has now become a part of the Bruker Nano Surfaces division, joining the current AFM (atomic force microscope) and SOM (stylus and optical metrology) businesses.
Roche and Arizona Technology Enterprises (AzTE) announced today an agreement to license several technologies developed by Dr. Stuart Lindsay at the Biodesign Institute at Arizona State University and Dr. Colin Nuckolls of the Columbia University Nanoscience Center for the development of a revolutionary DNA sequencing system.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, is the world's first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production.