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Innovative Through-Silicon Via Technology Implemented in High-volume MEMS Production

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and the leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, is the world's first manufacturer to have implemented Through-Silicon Via technology (TSV) in high-volume MEMS production.

Posted: Oct 11th, 2011

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ARM and UMC Extend Long-Term IP Partnership into 28nm

ARM and UMC, a leading global semiconductor foundry, today announced a long-term agreement that provides UMC foundry customers with access to the latest advanced ARM Artisan Physical IP solutions validated on UMC's 28HPM process technology.

Posted: Oct 6th, 2011

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RUSNANO and I2BF Global Ventures Invest in Ultracapacitor Manufacturer Nesscap Energy

Proceeds from this financing will be used as to approximately $15,000,000 for the establishment of a full scale production facility for ultracapacitors and fundamental research center in the Russian Federation and as to approximately $5,000,000 for the expansion of Nesscap's current manufacturing and core R+D operations in Korea and for general corporate purposes.

Posted: Oct 6th, 2011

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Analog Bits Uses Berkeley Design Automation to Deliver 100 Gbps 40nm PLL IP Silicon Success for SoC and Cloud Computing Applications

Berkeley Design Automation, Inc., provider of the world's fastest nanometer circuit verification, today announced that Analog Bits, a leading provider of integrated clocking and interface IP, has adopted and achieved excellent silicon correlation using the company's Analog FastSPICE Platform for accurate performance characterization of a 40nm nanometer Phase-Locked Loop (PLL) clocking circuit IP.

Posted: Oct 4th, 2011

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