3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company's application laboratory in Yangmei, Taiwan, for 200mm and 300mm temporary wafer bonding.
SouthWest NanoTechnologies' (SWeNT) Single-Wall Carbon Nanotubes, in a new research study, show absorption of Indocyanine Green - a functional dye with unique photomechanical, photochemical, and photobiological properties.
The three-year project, known as MODULED, will industrialize smart LED systems in France by simplifying functioning and assembly, reducing the mechanics and electronics of current LED systems, and incorporating the latest LED features.
Implen's latest NanoPhotometer Pearl application note describes the performance of proteins in terms of linearity and accuracy, applying cuvetteless small volume protein quantification at 280 nm (Protein UV280) as well as colorimetric cuvette based assays.
Cambridge NanoTech today announced the delivery of its 40th Fiji Plasma Atomic Layer Deposition (ALD) system. ALD is being used to enable high impact technologies, such as microelectronics, lighting and display, and energy storage.
Lumerical Solutions, Inc., a global provider of nanophotonic design software, today introduced MODE Solutions 5.0, the latest upgrade to its MODE Solutions waveguide design product. MODE Solutions 5.0 extends the flexible eigensolver technology of MODE Solutions 5.0 to include an electromagnetic propagator able to address optical components measuring up to hundreds of microns in extent, including silicon photonics components, optical interconnects, photonic crystal devices and resonators.
Celsion Corporation, a leading oncology drug development company, today announced that ThermoDox, its proprietary, heat-activated liposomal encapsulation of doxorubicin, was featured in a special issue of The Open Nanomedicine Journal highlighting recent advances, trends and challenges in the use of regional and local hyperthermia and nanomedicine in oncology.
RFaxis, a fabless semiconductor company focused on innovative, next-generation RF solutions for the wireless connectivity and cellular mobility markets, today unveiled its new 28nm CMOS silicon multi-band/multi-mode RF Front-end Integrated Circuit at the IWPC Conference on Next Generation Mobile Device Platform Architectures.