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Applied Materials Expands the Limits of Darkfield Wafer Inspection with Deep Ultraviolet Laser Technology

Applied Materials, Inc. announced a technology breakthrough for inspecting the challenging interconnect layers in 22nm and below memory and logic chips. The new Applied DFinderTM inspection system is the first darkfield tool to employ deep ultraviolet (DUV) laser technology, providing chip manufacturers with an unprecedented ability to detect exceptionally small particles on patterned wafers in a production environment for higher device yield.

Mar 17th, 2011

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Serefex Announces Photocatalyst Nanotechnology

Serefex Corporation announced today that it has begun marketing a line of exterior photocatalyst nanotechnology through its master distribution agreement with Rochester Hills, MI based Triton Technology Group.

Mar 16th, 2011

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