Haydale, the company focused on enabling technology for the commercialisation of graphene and other nano materials, has announced a major consulting agreement with The InVentures Group to accelerate the commercial application of its patent applied for plasma functionalisation technology in graphene, carbon nanotubes and other high performance nanomaterial systems.
Latest technology results from Irresistible Materials have demonstrated a significant jump forwards in achievable resolution via its EUV photoresist. The team have recently demonstrated 13 nm halfpitch resolution patterning, together with promising results at 11 nm halfpitch.
Digital Surf, a leading provider of surface imaging and metrology software for microscopes and profilers, and Image Metrology, a leading provider of nano- and microscale image processing software, have announced that they are joining forces.
Sensitive electro-optical imaging and target-acquisition systems will achieve new levels of range and sensitivity performance thanks to a UK company's breakthrough in developing a 'super black' material to be launched at the Farnborough International Air Show.
Park NX-Wafer produces sub-Angstrom roughness measurements for the flattest substrates and wafers with tip-to-tip variation of less than 2%, for the first time ever in the entire history of the semiconductor industry. This fully automated defect review and identification system enables a critical inline process to classify defect types and source their origin through high resolution 3D imaging only available at Park Systems, the world's leading AFM provider.
Dolomite have released the Mitos Dropix Droplet Merging System. It meets the needs of microfluidic applications that benefit from an advanced capability; the ability to combine pairs of droplets in a controlled manner.
The collaboration aims to further refine and develop Haydale's proprietary ink formulations to fully commercialize graphene based inks and coatings to realise their true potential in industrial and commercial applications.
The laser debonder can be used as a stand-alone, semi-automated system or as an integrated process module in SUSS MicroTec's XBC300 Gen2 platform. The debonding method used in the ELD300 relies on a 308nm Excimer laser to separate the glass carrier from a tape mounted thin wafer.