AIXTRON SE announced today that its Close Coupled Showerhead MOCVD Platform, a CRIUS CCS reactor in the 6x2-inch (3x3-inch or 1x6-inch) wafer configuration, has been ordered by the Hong Kong University of Science and Technology.
PEPperPRINT GmbH was announced on February 19, 2011 as the winner of the 2010 German Industry's Innovation Award in the category "Start-Up Companies". PEPperPRINT, a start-up company founded by scientists of the German Cancer Research Center (Deutsches Krebsforschungszentrum, DKFZ), produces peptide microarrays for research and diagnostics using a novel and low-cost technology.
Nanometrics Incorporated, a leading provider of advanced process control metrology systems, today announced that a leading manufacturer of advanced logic devices has taken delivery of its next generation UniFire 7900IR metrology system for 3D inspection of wafer-scale packaging features as well as registration for wafer-to-wafer bonding applications for use in advanced wafer scale packaging process control.
Accelrys, Inc., the leading scientific informatics software and services company, today announced at the Molecular Medicine Tri-Conference its entrance in the rapidly growing next generation sequencing (NGS) market with the release of the NGS Collection for Pipeline Pilot.
NanoBridge is the resistive switch where resistance changes between ON and OFF states when a nanometer scale Cu bridge is precipitated or dissolved into the solid electrolyte. When placed between the two Cu interconnects of LSI, NanoBridge can connect or disconnect the two interconnects by applying a bias voltage. Therefore, circuitry can be configured after manufacturing in order to implement logic functions.
Texas Instruments Incorporated (TI) and the Massachusetts Institute of Technology (MIT) today presented a joint research paper detailing design methodologies for a 28-nanometer mobile applications processor at the 2011 International Solid-State Circuits Conference (ISSCC).
The new book, "Scanning Probe Microscopy of Functional Materials", edited by Dr. Sergei Kalinin of the Oak Ridge National Laboratory and Alexei Gruverman of the University of Nebraska, describes cutting-edge nanoscale imaging and spectroscopy advances in the field of atomic force/scanning probe microscopy.
FLEX is designed as a multi-functional tool able to acquire images and spectra from the deep UV to the NIR. Offering transmission, reflectance, fluorescence as well as a host of other features, FLEX is a powerful addition to the laboratory.
EV Group, a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest addition to its portfolio of products created to optimize the manufacture of high-brightness light-emitting diodes (HB-LEDs), compound semiconductors and power electronics.
CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.
On February 8, 2011 the President of the Russian Federation Dmitry Medvedev attended the exhibition "The history of Russian innovations: from periodic table to graphene" that was held in the Polytechnical Museum and opened the 1st Russian Festival of Science. SOLVER NEXT was presented and aroused significant interest of the President.