RSS Subscribe to our Nanotechnology Business News feed

Rudolph Technologies Collaborates in Advanced Packaging Integration

Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities announced today that it will collaborate with a leading process tool supplier and an IC device manufacturer in the development of 3D advanced semiconductor packaging applications.

Jan 19th, 2011

Read more

Ener1 and Wanxiang Sign Strategic Joint Venture Agreement

Ener1, Inc., a leader in lithium-ion battery technology, and Wanxiang Electric Vehicle Co., Ltd., a division of the Chinese conglomerate Wanxiang Group Corporation, today signed a joint venture agreement to co-manufacture Li-ion cells and battery packs for the rapidly growing Chinese market.

Jan 18th, 2011

Read more

The University of Tokyo Picks Docea Power to Design Non-Volatile Memory Architecture

Docea Power, the design-for-low-power company that delivers software for power and thermal analysis at the architectural level (ESL), announced today that its Aceplorer software has been selected by the University of Tokyo to model and optimize power consumption for new non-volatile memory (NVM) designs and architectures as part of a Japanese national research project.

Jan 18th, 2011

Read more