XTI introduces ACTIVE-SHIELD Nanocoating, a revolutionary and environmentally-friendly transparent Photocatalyst Nanocoating for sterilizing consumer products and interior surfaces in buildings, medical facilities, automotives and airplanes.
Ultratech, Inc., a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today officially opened an advanced manufacturing facility in Singapore.
Sirnaomics, Inc. announced today that the company has cemented a partnership with a Chinese pharmaceutical company for development of its small interfering RNA (siRNA) therapeutic (STP705) for scarless wound healing.
Soitec, the world's leading supplier of engineered substrates and Sumitomo Electric Industries, Ltd., a leading worldwide provider of compound semiconductor materials, announced today they are working together to develop engineered gallium nitride (GaN) substrates.
Magma Design Automation Inc., a provider of chip design software, today unveiled Talus 1.2, a next-generation integrated circuit implementation solution that accelerates the design cycle of systems on chip (SoCs).
SUSS MicroTec, a leading supplier of equipment and process solution for the semiconductor industry and related markets, today announced that it has entered into a joint development and exclusive license agreement with Rolith, Inc. to develop and build nanostructuring equipment employing a disruptive nanolithography method developed by Rolith.
Advancing biological research with high-quality mass spectrometry analysis is the basis of a new service offered by Promega and MS Bioworks. Now scientists worldwide can access protein mass spectrometry expertise and leading-edge instrumentation with fast turnaround times. The service covers sample processing, high-quality analysis and transparent consulting from design to analysis.
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has developed a new micro-lens molding process that can enable volume production of very-high-resolution (up to eight megapixels and higher) wafer-level optics for use in smart phones, pico projectors and myriad other applications.