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Shrink Nanotechnologies Forms Subsidiary to Commercialize Suite of Biomedical Research Tools

Shrink Nanotechnologies, Inc. announced today the formation a new wholly-owned subsidiary, Shrink Chips LLC, which is dedicated to the commercialization of a suite of next-generation biotechnology research tools, including its patent-pending ShrinkChip Rapid Prototyping System (RPS) which is used to inexpensively and flexibly manufacture microfluidic chips, or Lab-on-a-Chip (LOC), devices as well as many other biological and chemical sensors.

Aug 3rd, 2010

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Henkel Launches Wafer Backside Coating Technology for Stacked Die Packages

Recognized for its ease of use and cost-effectiveness with die attach processes for leadframe packages, Henkel has extended its Wafer Backside Coating (WBC) portfolio to also include a solution for stacked die packages. Ablestik WBC-8901UV has been designed to address the demanding requirements of multiple die stack applications for the memory market segment, including packages such as TSOPs, MCPs and FMCs (Flash Memory Cards).

Aug 2nd, 2010

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