Veeco Instruments Inc. announced today that Hangzhou Silan Azure Co. Ltd., one of the largest LED manufacturers in China, has placed a multi-tool order for Veeco's TurboDisc K465iTM Metal Organic Chemical Vapor Deposition (MOCVD) Systems.
Ascent Solar Technologies, Inc., a developer of state of the art flexible thin-film solar modules, has announced that it has become the first manufacturer of thin-film flexible monolithically integrated CIGS modules to receive full IEC 61646 certification upon completion of environmental testing.
Solar Frontier announced today that it will supply GE with its proprietary CIS (copper, indium, and selenium) thin-film solar modules as part of GE's globally marketed portfolio of solar energy solutions.
SiEnergy Systems LLC, a Harvard spin-off company commercializing novel solid oxide fuel cells using nanometer scale oxide thin films, will be exhibiting at the 2010 Fuel Cell Seminar and Exposition to be held in San Antonio, TX from October 18th to 21st.
A group of ground-breaking American and Russian scientists, led by Dr. Terry Lowe, chief scientist at Manhattan Scientifics are taking Cold War weapons technology and repurposing it for peaceful use in medical prosthetics and dental implants.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new technology capability that enables ultra-high-resolution patterning of features down to 12.5 nm: Soft Molecular Scale Nanoimprint Lithography (SMS-NIL).
Diamon-Fusion International, Inc., global developer and exclusive licensor of patented hydrophobic nanotechnologies, announced today the company along with its partner, New York Poly Steel, has secured a bid for a large-scale coating project for the original Tiffany and Co. building at 15 Union Square Street in New York City.
NanoLogix, Inc. announces its new Quick-Test product line for detection and identification of aerobic live-cell bacteria. With the NanoLogix Quick-Tests, the research community will be able to obtain high-sensitivity analysis results in reduced time with lower costs than traditional technologies.
Veeco Instruments Inc. announced today it has been selected by leading global hard disk drive manufacturers for critical technology that enables higher areal density for next generation thin film magnetic heads.
AMO GmbH, a private research service provider in the field of nanofabrication, and SUSS MicroTec AG, a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets, are working on the development of applications for SCIL (Substrate Conformal Imprint Lithography) with UV curing material.
GLOBALFOUNDRIES today announced a strategic partnership with SVTC Technologies to accelerate the move to high-volume manufacturing of Microelectromechanical Systems (MEMS). The collaboration, which will focus on joint technology development, will help GLOBALFOUNDRIES achieve its goal of becoming a MEMS foundry leader.
The Singapore Institute of Manufacturing Technology (SIMTech), a research institute of the Agency for Science, Technology and Research (A*STAR), today launch the Nanotechnology in Manufacturing Initiative (NiMI). Supported by International Enterprise(IE) Singapore, Singapore Economic Development Board (EDB) and SPRING Singapore, this initiative explores nanomaterials for industry applications and addresses challenges in the adoption of nanotechnology for manufacturing.
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced today the industry's first production of a 3-bit-cell (3bit), 64 gigabit (Gb) NAND flash using 20 nanometer-class process technology. The highly advanced new chip can be used in high-density flash solutions such as USB flash drives (UFDs) and Secure Digital (SD) memory cards.
GLOBALFOUNDRIES today introduced three newly certified design services companies as part of its GLOBALSOLUTIONS partner ecosystem. Infotech Enterprises Limited, Verisilicon, and Wipro Limited have joined GLOBALSOLUTIONS, further strengthening the company's ability to help customers accelerate time-to-volume for complex systems-on-chip (SoCs) on advanced technology nodes.