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Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications

Novellus Systems has announced that it has developed conformal film deposition technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology addresses sub-32nm requirements for front-end-of-line (FEOL) applications such as gate liners and spacers, shallow trench isolation high-k metal gate (HKMG) liners, and spacers used for double patterning applications.

Posted: Aug 17th, 2010

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Rehm Thermal Systems Shows Solar Equipment for Metallization Lines at EU PVSEC 2010

Rehm Thermal Systems presents an advanced new series of drying systems and firing systems for solar cell metallization at EU PVSEC in Valencia, September 6-9, 2010. These Systems offer a range of advanced process features and thermal control that enable PV manufacturers to move their processes to an entirely new level of efficiency and yield.

Posted: Aug 13th, 2010

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