Rehm Thermal Systems presents an advanced new series of drying systems and firing systems for solar cell metallization at EU PVSEC in Valencia, September 6-9, 2010. These Systems offer a range of advanced process features and thermal control that enable PV manufacturers to move their processes to an entirely new level of efficiency and yield.
Scientists at GE Global Research in collaboration with Air Force Research Laboratory, State University at Albany, and University of Exeter, have received a four-year, $6.3 million award from the Defense Advanced Research Projects Agency (DARPA) to develop new bio-inspired nanostructured sensors that would enable faster, more selective detection of dangerous warfare agents and explosives.
Asylum Research and Oak Ridge National Laboratory (ORNL) have just received the prestigious Microscopy Today Innovation Award for the development of Band Excitation (BE), a new breakthrough scanning probe microscopy (SPM) technology.
Veeco Instruments Inc. announced today that Elec-Tech International has selected its TurboDisc K465i Metal Organic Chemical Vapor Deposition (MOCVD) systems as their 'tool of choice' for two new LED factories in Wuhu and Yangzhou, China.
Toshiba America Electronic Components, Inc is introducing 32nm double data rate Toggle Mode NAND, in multi-level cell (MLC) versions with densities of 64Gb, 128Gb and 256Gb and single-level cell (SLC) versions with densities of 32Gb, 64Gb and 128Gb.
Under the agreement, the two companies will jointly develop and cross-license related controller technologies for solid state drive (SSD) storage devices to attain the high levels of performance, reliability and endurance demanded by enterprise storage applications.
As part of its ongoing series of live webinars on AFM technology and advancements, Veeco Instruments Inc. will be hosting a free online seminar on 'Atomic Force Microscopy Techniques in Food Research'.
Enjoying the materials innovation success it has realized with its first DEK Galaxy system, Cary, North Carolina-based LORD Corporation recently expanded its development capacity with the addition of a second Galaxy equipped with DEK's new Wafer Transport Solution.