EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG610 mask and bond aligner, specifically to address its university and research customers' demands for a lower costing system with greater process versatility.
Applied DNA Sciences, Inc. and H.W. Sands Corp. announced the signing of an Agreement to jointly market and sell DNA security-based solutions to clients that are dedicated to protecting their products, supply chains and end consumers from counterfeiting and gray market diversion.
Irilliant, Inc., a developer of high-throughput manufacturing processes for nanomaterials, has further enhanced and protected its CAFS (Chemical Aerosol-Flow Synthesis) process with a soon-to-be-issued U.S. patent.
PI (Physik Instrumente) L.P -- a leading manufacturer of piezo ceramic actuators and precision motion-control equipment for semiconductor, bio-medical and nanotechnology applications -- has released a new brochure on Lever Amplified Piezo Flexure Actuators.
Both companies have signified their intention to enter into a long-term supply agreement whereby Thomas Swan will provide Vendum with R+D and production quantities of carbon nanotubes at a preferential price in return for exclusivity of supply.
CERAM, a global expert in materials testing, analysis and consultancy, has published a new white paper outlining the advantages of employing a range of modern surface characterisation techniques to obtain quantitative chemical and physical information on the structure and composition of semiconductor materials.
Picosun Oy, Finland-based global manufacturer of state-of-the-art Atomic Layer Deposition (ALD) systems highlighted today the results obtained by the Swedish nanotechnology company Nanexa, using Picosun's SUNALE ALD systems.
The Stratus S300 tools are used for production of multiple advanced packaging technologies enabling the foundry to deliver high volume, high performance, and low cost of ownership for next generation bumping solutions to its customers as well as to enable further collaboration with NEXX on development of future advanced packaging applications.