NanoeXa today announced additional partnering opportunities for Li-ion 160 cathode materials in Asia, 250 cathode materials in the US, and for development and application of Quantum Simulation Software (QSS) for battery materials solutions and possible future extensions to ultra capacitors, solar cells, fuel cells and other industries utilizing metal oxides.
To advance its work in next-generation 3D semiconductor integration, the newly opened All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic packaging and system integration center run by the Fraunhofer IZM Institute, has ordered a 300 mm AltaCVD system from equipment supplier Altatech Semiconductor S.A.
GE has announced that it has signed a contract to supply an ultrapure water system to GLOBALFOUNDRIES' new semiconductor manufacturing facility currently under construction at the Luther Forest Technology Campus in Saratoga County, N.Y.
API Technologies Corp., a prime contractor in highly engineered solutions, systems, secure communications and electronic components to the global defense and aerospace industries, announced today that it has closed the sale of the assets from its previously announced discontinued nanotechnology subsidiary.
Industrial Nanotech, Inc. announced today that the Company's patented Nansulate thermal insulation and mold prevention coating has been awarded the NOM certification and is now part of the Green Mortgage program by INFONAVIT, Mexico's state owned and largest mortgage provider.
SEMATECH, a global consortium of the world's leading chip manufacturers, and Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies, products and services, today announced that Qualcomm has entered into a collaborative agreement with SEMATECH to advance CMOS scaling and assess new technologies.
Pyxis Technology, Inc., the company innovating software solutions for the physical design and routing of custom integrated circuits (ICs), announced today that its NexusRoute-HPC (high performance custom) router has been selected for use in the TSMC 28nm Analog and Mixed-Signal (AMS) Reference Flow 1.0.
Toshiba Corporation today announced that it has developed a breakthrough technology for a nanowire transistor, a major candidate for a 3D structure transistor for system LSI in the 16nm generation and beyond.
Cambridge NanoTech, a world leader in Atomic Layer Deposition (ALD) science and equipment, today announced that they have partnered with Stanford University's Center for Integrated Systems (CIS), a partnership between academia and industry that supports leading edge research into semiconductor and advanced electronics.
SouthWest NanoTechnologies, Inc., a leader in high quality, single-wall and specialty multi-wall carbon nanotubes, will be exhibiting and presenting a paper at the Nano Science and Technology Institute (NSTI) Nanotech Conference and Expo 2010 June 21-24.
EdXact, post-layout verification specialist today announced that its netlist reduction software Jivaro has been included in TSMC's Analog/Mixed-Signal (AMS) Reference Flow for 28nm analog and mixed-signal circuit design.
mPhase Technologies, Inc. reported today that it has been granted a United States patent for the concept of a porous membrane made from silicon that is capable of controlling the flow of a wide range of liquids, including electrolytes, used in both primary and rechargeable batteries.