Industrial Nanotech, Inc. announced today that the Company's patented Nansulate thermal insulation and mold prevention coating has been awarded the NOM certification and is now part of the Green Mortgage program by INFONAVIT, Mexico's state owned and largest mortgage provider.
SEMATECH, a global consortium of the world's leading chip manufacturers, and Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies, products and services, today announced that Qualcomm has entered into a collaborative agreement with SEMATECH to advance CMOS scaling and assess new technologies.
Pyxis Technology, Inc., the company innovating software solutions for the physical design and routing of custom integrated circuits (ICs), announced today that its NexusRoute-HPC (high performance custom) router has been selected for use in the TSMC 28nm Analog and Mixed-Signal (AMS) Reference Flow 1.0.
Toshiba Corporation today announced that it has developed a breakthrough technology for a nanowire transistor, a major candidate for a 3D structure transistor for system LSI in the 16nm generation and beyond.
Cambridge NanoTech, a world leader in Atomic Layer Deposition (ALD) science and equipment, today announced that they have partnered with Stanford University's Center for Integrated Systems (CIS), a partnership between academia and industry that supports leading edge research into semiconductor and advanced electronics.
SouthWest NanoTechnologies, Inc., a leader in high quality, single-wall and specialty multi-wall carbon nanotubes, will be exhibiting and presenting a paper at the Nano Science and Technology Institute (NSTI) Nanotech Conference and Expo 2010 June 21-24.
EdXact, post-layout verification specialist today announced that its netlist reduction software Jivaro has been included in TSMC's Analog/Mixed-Signal (AMS) Reference Flow for 28nm analog and mixed-signal circuit design.
mPhase Technologies, Inc. reported today that it has been granted a United States patent for the concept of a porous membrane made from silicon that is capable of controlling the flow of a wide range of liquids, including electrolytes, used in both primary and rechargeable batteries.
The needs of society are driving the nano revolution, with applications springing up anywhere they will have societal benefit. The latest issue of NANO Magazine looks at a number of these benefits in different sectors, including the automotive industry, transport, medicine, food, textiles and inket devices.
SEMATECH today announced that Sitaram Arkalgud, director of 3D interconnect program at SEMATECH, will speak to leading technologists and electronics design suppliers attending the 47th Design Automation Conference.
Over 4,000 engineers, scientists and industry professionals from around the world gathered at the Donald E. Stephens Convention Center in Rosemont, IL last week for the Sensors Expo and Conference, the leading event in North America focused exclusively on sensors and sensor-integrated systems.
Under the terms of the common laboratory agreement, CEA-Leti will use EDA tools provided by Docea Power to build 3D-IC designs and methodologies for developing advanced applications consumer and wireless.
This joint development is set to establish a 3D IC research and development line at IME's facility in Singapore using EVG's wafer bonding, alignment and lithography systems for 200- and 300-mm through silicon via (TSV) process development.