Cadence Design Systems, Inc. today introduced the Cadence SOI Design Hub, a new Web portal that lowers the barriers to adopting silicon-on-insulator (SOI) technology through comprehensive silicon-proven design enablement solutions and services.
Industry leading digital cell library creation and characterization solution deployed at austriamicrosystems to considerably increase library development productivity and improve IP portfolio performance and quality.
Vorbeck Materials Corp., the world's leading producer of graphene-based materials and manufacturer of the world's first commercial graphene-based product, Vor-ink conductive inks, announces a new conductive ink formulation for flexographic printing, Vor-ink Flexo.
CNano Technology Limited announced that it officially launched carbon nanotube based super conductive paste products for Lithium ion battery applications, and also introduced the products into the Japanese market.
Camtek Ltd. announced today that it has entered into a joint development agreement with IBM Corporation and will be joining a new industry alliance aimed at optimizing systems and processes for next-generation three-dimensional (3D) semiconductor packaging.
Crossing Automation, Inc., today announced that its Spartan equipment front end module (EFEM) has been selected by a leading manufacturer of lithography and metrology equipment for its second-generation metrology tool.
Park Systems, the leading nanotechnology solutions partner of nanoscale measurements and systems for both research and industry and The Institute for Molecules and Materials(IMM) at Radboud University, are co-organizing the workshop for Ion Conductance Microscopy, to be held at Radboud University, June 24th, 2010.
These reusable integrated fluidic circuits (IFCs) will dramatically lower SNP genotyping costs and are designed to support accelerated sample throughput, while maintaining data quality of 99.75 percent or greater accuracy and 99 percent or greater call rates.
Tegal Corporation, an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today announced it has received an order for an additional Tegal 4200 SE DRIE cluster tool process module from a leading EU-based supplier of MEMS and Power IC devices.