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SPTS to Supply 300mm Technology to New Fraunhofer ASSID Center

SPP Process Technology Systems (SPTS), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, has announced that it has received an order for a Pegasus DSi Deep Silicon etch system supported on the Omega fxP cluster platform, for 3D-IC through silicon via (TSV) application from Fraunhofer IZM

Jun 1st, 2010

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Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs

May 31st, 2010

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