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SPTS to Supply 300mm Technology to New Fraunhofer ASSID Center

SPP Process Technology Systems (SPTS), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, has announced that it has received an order for a Pegasus DSi Deep Silicon etch system supported on the Omega fxP cluster platform, for 3D-IC through silicon via (TSV) application from Fraunhofer IZM

Posted: Jun 1st, 2010

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Fraunhofer IZM-ASSID selects EV Group Temporary Bonding and Debonding Equipment for Devoloping Processes for High-Volume Manufacturing of 3D ICS

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that world-renowned research institute, Fraunhofer IZM-ASSID, has placed an order for two EVG temporary bonding and debonding (TB/DB) systems for thin-wafer handling and processing for 3D ICs

Posted: May 31st, 2010

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eSilicon Expands in Asia Through Acquisition of Silicon Design Solutions

eSilicon Corporation, the largest independent semiconductor Value Chain Producer (VCP), today announced the completion of its asset acquisition of Silicon Design Solutions (SDS), a privately held company supplying niche semiconductor memory intellectual property and design services to manufacturers and designers of cutting-edge SoCs.

Posted: May 27th, 2010

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Nanometrics to Present at RBC Technology Conference

Nanometrics Incorporated, a leading provider of advanced process control metrology systems used primarily in the fabrication of semiconductors, high-brightness LEDs, data storage devices and solar photovoltaics, today announced that Dr. Timothy Stultz, President and CEO, will present at the RBC Capital Markets Technology, Media and Communications Conference in New York, NY on Thursday, June 10, 2010.

Posted: May 27th, 2010

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