Shrink Nanotechnologies, Inc. announced today that its wholly-owned subsidiary, Shrink Solar LLC, is pleased to unveil the fifth generation of its solar concentrator technology, which is based on the Company's proprietary NanoShrink material and its unique photovoltaic quantum dot composition.
Spire Corporation, an American global solar company providing capital equipment and turnkey production lines to manufacture photovoltaic modules, today announced the introduction of a 6 meter by 1.3 meter solar simulator.
Novellus Systems announced that it has developed an innovative DirectFill CVD tungsten nitride (WN) liner-barrier film that replaces the conventional physical vapor deposition (PVD) Ti liner and metallo-organic chemical vapor deposition (MOCVD) TiN barrier film stack used for the tungsten via to copper interconnect application in advanced memory devices.
Beneq, a world-leading manufacturer of ALD and aerosol coating equipment, has won the prestigious Nanotech Finland Award in the category for Best Business Potential. Beneq CEO Mr Sampo Ahonen received the award on Tuesday, May 4th, at the final seminar of Finland's nanotech initiative FinNano.
At the 31st Conference on Mechanical Engineering (ICME 2010) in Israel, Sales Manager Cedric Goueffon will make a presentation of the unique advantages of multilayer piezoelectric actuators. Noliac will also exhibit their products with American Aviation Ltd., who represents Noliac in Israel.
Researchers from the Max Planck Institute (MPI), Cold Spring Harbor Laboratory (CSHL), Agilent Technologies Inc., and other prestigious institutions worldwide have shown that DNA capture techniques can greatly enable the sequencing of ancient Neandertal DNA, providing new insight into the nature of these prehistoric hominids.
Evolution Solar applauded the news that Scientists at the Massachusetts Institute of Technology (MIT) have successfully coated paper with a solar cell, part of a suite of research projects aimed at energy breakthroughs.
Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the availability of IC Compiler 2010.03, a physical implementation solution delivering up to 2.5X faster performance on multicorner/multimode (MCMM) designs, and enhanced In-Design technology for faster design closure.
The multi-year sponsored research project focuses on developing commercial applications for shrinkable plastic-based biological chips and devices for commercial high-volume applications such as ultra-functional immunoassay substrates and biotechnology and stem cell research tools.