Bruker Corporation announced today that it has created a Chemical Analysis Division within its Bruker Daltonics subsidiary. The new Chemical Analysis Division will be managed by Collin D'Silva as division president, and will be headquartered in Fremont, California.
For the first time, the Minalogic cluster, Ubifrance, the French Ministry of the Economy, Industry and Employment (through the Directorate for Competitiveness Industry and Services), the San Francisco Trade Mission and the AEPI (Grenoble-Isere Economic Development Agency) will be organizing technological partnership meetings at ESC Silicon Valley 2010, to be held from April 26 to 29, 2010, in San Jose, California.
The Pacific Northwest National Laboratory is bringing an ORION PLUS instrument into the U.S. Department of Energy's Environmental Molecular Sciences Laboratory as a resource. And, in Tsukuba, Japan, the National Institute of Advanced Industrial Science and Technology (AIST) has selected an ORION PLUS for their new Nanodevice Innovation Research Center.
Asylum Research, a technology leader in scanning probe/atomic force microscopy (AFM/SPM) announces a new application note by the Ginger group at the University of Washington, focusing on their work on Organic Photovoltaics.
BioNanomatrix, Inc., a developer of breakthrough single-molecule genomic analysis technology, today announced the issuance of U.S. patent 7,670,770 for nanochannel arrays that enable high-throughput macromolecular analysis. Also disclosed are methods of preparing nanochannel array chips, methods of analyzing macromolecules such as entire strands of genomic DNA, and systems for implementing these methods.
Thermacore, Inc., announced today that Thermacore Europe is making tremendous progress as lead partner of an 8.3 million euro European research project, NanoHex. The team is tasked with developing a next-generation liquid coolant that incorporates purpose engineered nanoparticles for more efficient cooling.
Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that the Galaxy Implementation Platform has helped Infineon Technologies AG achieve first-pass silicon success of the 40-nanometer baseband processor for its X-GOLD 626 3G wireless analog and digital system-in-package.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Morocco-based wafer-level camera manufacturer Nemotek Technologie has placed a repeat order for EVG's bonding and UV nanoimprint lithography (UV-NIL) systems - the EVG520IS and IQ Aligner.
The World biggest semiconductor foundry from Taiwan has placed a combined order for the Mask Defect Repair System MeRiT HR 32 and the Aerial Image Measurement System AIMS 32-193i from Carl Zeiss to prepare for the production of next generation high-end photomasks.