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Mentor Graphics Corp., a leader in electronic design automation, and STMicroelectronics one of the world's leading semiconductor suppliers, today announced a broad-scoped collaboration to develop advanced design solutions at the 32-nm technology node and down to 20-nm node.
Mar 17th, 2010
Read moreNovellus Systems today announced the establishment of a joint development program with the IBM Corporation to design a manufacturing-worthy, copper-based, three dimensional semiconductor Through-Silicon Via process using Novellus' SABRE copper electroplating and VECTOR plasma-enhanced chemical vapor deposition systems.
Mar 17th, 2010
Read moreExponent Testing's preliminary results show better-than-anticipated performance for EcoloCap's Nano Lithium Battery.
Mar 17th, 2010
Read moreCamtek Ltd. announced today that a leading Semiconductor Foundry in Taiwan has selected the Falcon, Camtek's Automatic Optical Inspection system, for metrology and inspection solution for the 3D integration circuits process.
Mar 17th, 2010
Read moreDolomite is sponsoring 5 undergraduate students of the University of Waterloo, Canada, in developing a new micropump technology as part of the Nanotechnology Engineering Programme.
Mar 17th, 2010
Read moreFor a limited time, and only available online, these special web promotions include a price reduction on Zeiss's top-rated stereomicroscopy instrument and a 5 percent discount for conversion of certain existing models of Zeiss research microscopes into a 3D imaging workstation.
Mar 17th, 2010
Read moreAIXTRON AG today announced an order for one Black Magic CNT (carbon nanotube) deposition system from the Eidgenoessische Materialpruefungs- und Forschungsanstalt (EMPA), Switzerland.
Mar 17th, 2010
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Seiko Instruments Inc. has succeeded in developing a high precision siliconbased MEMS resonator. In addition, it has also succeeded in the development of a new wafer level packaging technology for vacuum sealing MEMS devices.
Mar 17th, 2010
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Veeco Instruments introduces the Dimension Edge Atomic Force Microscope (AFM) System for physical and life sciences applications where high AFM performance is essential but budgets are limited.
Mar 16th, 2010
Read moreD2S, an emerging design and software company, today announced its new design for e-beam (DFEB) mask technology for the production of advanced optical photomasks with circular and curvilinear shapes.
Mar 16th, 2010
Read moreEnvia Systems announced today that it was awarded a $4 million grant from the U.S. Department of Energy's (DOE) newly formed Advanced Research Projects Agency-Energy (ARPA-E) and $1 million from the California Energy Commission (CEC).
Mar 16th, 2010
Read moreA Tegal 110 S/DE DRIE tool will ship in the current quarter, and will be installed in the McGill Nanotools - Microfab, located in Montreal, Canada.
Mar 16th, 2010
Read moreAdvanced Diamond Technologies announces UNCD T30TM, a new addition to its growing UNCD family of diamond materials. UNCD T30 is specifically optimized to withstand fluid loss or dry running in mechanical seals for fluid pumps.
Mar 16th, 2010
Read moreIllumina, Inc. today unveiled its new HumanOmniExpress+ Custom BeadChip (OmniExpress+), an enhancement to the recently announced OmniExpress BeadChip that allows for the addition of up to 200,000 custom variants for a total of >900k variants per sample.
Mar 16th, 2010
Read moreEnergy harvesting is used by the ABB R+D Centers Ladenburg, Germany and Daettwil, Switzerland, and Micropelt, Freiburg, Germany to replace the battery with an unlimited, green, sustainable, maintenance-free power supply.
Mar 16th, 2010
Read moreThe Access Array system enables users to automatically prepare sequencing-ready libraries from up to 48 individual samples at a time, for as little as 7 euros per sample.
Mar 16th, 2010
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