Seiko Instruments Inc. has succeeded in developing a high precision siliconbased MEMS resonator. In addition, it has also succeeded in the development of a new wafer level packaging technology for vacuum sealing MEMS devices.
Envia Systems announced today that it was awarded a $4 million grant from the U.S. Department of Energy's (DOE) newly formed Advanced Research Projects Agency-Energy (ARPA-E) and $1 million from the California Energy Commission (CEC).
Advanced Diamond Technologies announces UNCD T30TM, a new addition to its growing UNCD family of diamond materials. UNCD T30 is specifically optimized to withstand fluid loss or dry running in mechanical seals for fluid pumps.
Illumina, Inc. today unveiled its new HumanOmniExpress+ Custom BeadChip (OmniExpress+), an enhancement to the recently announced OmniExpress BeadChip that allows for the addition of up to 200,000 custom variants for a total of >900k variants per sample.
Energy harvesting is used by the ABB R+D Centers Ladenburg, Germany and Daettwil, Switzerland, and Micropelt, Freiburg, Germany to replace the battery with an unlimited, green, sustainable, maintenance-free power supply.
The Soitec Group, the world's leading supplier of engineered substrates for the microelectronics industry, announced today that the company has entered into an agreement to supply silicon-on-insulator (SOI) substrates to CSMC Technologies Corporation, a leading pure-play specialty analog foundry based in China.
Asylum Research, a technology leader in Scanning Probe and Atomic Force Microscopy (SPM/AFM), has announced eight new grants for early adopters to explore the capabilities and applications of the unique new Band Excitation technique.