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M+W Zander Named General Contractor for the GLOBALFOUNDRIES Fab 2

The international engineering company M+W Zander has been awarded a contract for approximately 550 million Euro from GLOBALFOUNDRIES, the world's first truly global leading-edge semiconductor manufacturing company, to engineer and construct its new semiconductor wafer facility 'Fab 2'.

Oct 13th, 2009

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SHHIC Adopts Broad Range of Cadence Solutions for Advanced Semiconductor Design

Cadence Design Systems, Inc., the leader in global electronic design innovation, today announced that Shanghai Huahong Integrated Circuits Company Ltd. (SHHIC), a leading Chinese fabless semiconductor company, has adopted a broad range of Cadence solutions and services for the design of advanced chips targeting China's fast-growing electronics market.

Oct 12th, 2009

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JSC Sitronics and RUSNANO Launch 90 Nanometer Chip Production Project in Russia

JSC SITRONICS, a leading provider of telecommunications, information technology and microelectronic solutions in Russia and the CIS, with a growing presence in other EEMEA emerging markets, announced that it today signed the investment agreement to launch full-scale 90 nanometre microchip production in cooperation with the Russian Corporation of Nanotechnologies, Sistema and 'NIIME and Mikron'.

Oct 9th, 2009

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MEMC Electronic Materials Announces Executive Changes

The changes align the business around MEMC's primary end-markets, semiconductor and solar, placing operating responsibility with two senior executives as the company moves closer to a more formalized business unit structure in the future.

Oct 9th, 2009

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