Fluidigm Corporation, the inventor of integrated fluidic circuits (IFCs), has appointed Nano Gen Teknolojileri Ltd. as its exclusive distributor for the BioMark and EP1 Systems for genetic analysis in Turkey.
Nanonex Corp. was invited by Argonne National laboratory to introduce its low-cost, high-throughput, large-area patterning of 3D nanostructures with sub-10 nm resolution and accurate overlay alignment nanoimprint lithography (NIL) solution at Center for Nanoscale Materials (CNM) Users Meeting in October 2009.
NanoBio Corporation today announced an award from the National Institute of Allergy and Infectious Diseases, a Division of The National Institute of Health, to fund vaccine research associated with 'Innate Immune Receptors and Adjuvant Discovery'.
Altair Nanotechnologies Inc., a leading provider of energy storage systems for clean, efficient power and energy management, today announced it has signed a research agreement with the U.S. Army RDECOM Acquisition Center for a cost reimbursement contract that could be worth up to $1.75 million.
Diamon-Fusion International, Inc., global developer and exclusive licensor of patented hydrophobic nanotechnologies, announced today the launching of DFI's nano-coating by Viglacera, a highly reputable and one of the largest sanitary ware producers in South East Asia.
Nanosphere, Inc., a leader in the development and commercialization of advanced molecular diagnostics systems, announced today it has received 510(k) clearance from the FDA for its influenza A + B and respiratory syncytial virus (RSV) test and the Verigene SP System, with complete sample-to-result automation.
The international engineering company M+W Zander has been awarded a contract for approximately 550 million Euro from GLOBALFOUNDRIES, the world's first truly global leading-edge semiconductor manufacturing company, to engineer and construct its new semiconductor wafer facility 'Fab 2'.
EcoActive Surfaces, Inc., announced today the results of independent laboratory testing that demonstrate dramatic killing of viruses on surfaces treated with the advanced antimicrobial surface coating OxiTitan VLR.
Today KLA-Tencor Corporation, the world's leading supplier of process control and yield management solutions for the semiconductor and related industries, extended its product offerings in the CMOS image sensor (CIS) market by announcing the 8900 defect inspection system.
IBM Research today announced it has received an 'Advanced Sequencing Technology Award' from the National Human Genome Research Institute (NHGRI) to design a silicon-based 'DNA Transistor' that will advance genome sequencing technology and generate progress in health care diagnosis and practice.
Cadence Design Systems, Inc., the leader in global electronic design innovation, today announced that Shanghai Huahong Integrated Circuits Company Ltd. (SHHIC), a leading Chinese fabless semiconductor company, has adopted a broad range of Cadence solutions and services for the design of advanced chips targeting China's fast-growing electronics market.
Shrink Nanotechnologies, Inc. today announced a strategic alliance with Inabata America Corporation to market and sell the Company's OptiSol Solar Concentrator technologies and ShrinkChip Rapid Prototyping Solution.
Dow Corning and AIXTRON AG today announced that Dow Corning is extending its SiC epitaxy capabilities with the latest generation AIXTRON Planetary Reactor platform AIX 2800G4 WW for 10x100 mm and future 6x150 mm SiC wafers.