Mobius Photonics, an innovative producer of short pulsed fiber laser sources (IR, green, and UV laser), announces that its G1+ Laser System has been used in stimulated emission depletion (STED) microscopy experiments at the Max Planck Institute for Biophysical Chemistry.
Air Products today announced it has signed, through its subsidiary Air Products San Fu Co. Ltd. in Taiwan, a long-term contract to provide nitrogen to NexPower Technology Corporation, at its new thin-film photovoltaic facility in the Central Taiwan Science Park in Houli, Taichung, Taiwan.
Cancer Therapeutics, Inc., an emerging biotechnology business incubator with a specific emphasis on disruptive cancer treatments and nanotechnology, announced today it has named Dr. Mark Kester to its Advisory Board.
As the global market for advanced technology continues its endless march forward, the semiconductor foundry industry needs to embrace a new business model to sustain the current pace of innovation, according to Doug Grose, chief executive officer of GLOBALFOUNDRIES.
PharmaNova, a leader in nanotechnology-based Drug Delivery Systems, is due to exhibit at the 2009 annual meeting of the American Association of Pharmaceutical Scientists (AAPS) scheduled in Los Angeles, CA, from November 8 - 12.
Groundbreaking work by scientists from Switzerland, Finland and Germany has lead to a new world record in X-ray microscopy. For the first time ever, features below 10 nanometres in width were resolved.
Diamon-Fusion International, Inc., global developer and exclusive licensor of patented hydrophobic nanotechnologies, has been recognized by Glass Magazine with the highly coveted Crystal Achievement Award for the Most Innovative Protective Glazing Product category for its NanoPax product line.
Cadence Design Systems, Inc., the leader in global electronic design innovation, announced today that the Cadence Physical Verification System has adopted the new interoperable physical verification formats for 40-nanometer designs, consisting of iDRC for design rule checking and iLVS for layout vs. schematic checking, developed by Taiwan Semiconductor Manufacturing Company.
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the RFID/USN Center has selected EVG's fully automated GEMINI wafer bonding system for stacked 3D MEMS device development.
Nova Measuring Instruments Ltd., provider of leading edge stand-alone metrology and the market leader of integrated metrology solutions to the semiconductor process control market, today announced that its NovaT500 and NovaMARS have been selected as the metrology solution of record for both the 22nm and 32nm technology nodes, at one of the world's leading foundries.
DuPont Air Products NanoMaterials L.L.C. [DA NanoMaterials], a 50/50 joint venture of DuPont and Air Products, and a leading supplier of chemical mechanical planarization (CMP) slurries to the semiconductor fabrication industry, today announced the opening of its new Asia Headquarters in Jhudong Township, Taiwan, just outside Hsinchu Science Park.