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Technic's New New High Speed Copper Eliminates Wafer Bowing

Designed for Semiconductor plating applications where single sided copper electroplating of large areas is required, Semiplate Cu is a high speed copper plating process capable of depositing copper at 40 - 60 ASF with virtually no internal stress in the deposit.

Posted: Aug 23rd, 2009

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A Corrected View of the Sub-Angstrom World

Carl Zeiss, a leading global provider of electron- and ion-beam imaging and analysis solutions, today presents its newly developed line of corrected LIBRA 200 transmission electron microscopes.

Posted: Aug 19th, 2009

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