Introduced in 2006, the Dektak 150 has been widely accepted as a superior solution for measuring thin film thickness, stress, and surface roughness and form in a wide range of settings, from educational research verification to semiconductor process control.
Energetiq Technology, Inc., a developer and manufacturer of specialized short-wavelength light products for advanced technology applications, has been given an Outstanding Contribution Award at the 2009 International Workshop for EUV Lithography, for excellent performance of the Energetiq EUV light source and the company's contribution to EUVL development.
Magma Design Automation Inc., a provider of chip design software, today announced availability of an advanced low-power IC implementation reference flow for the 65-nanometer process and low-leakage-process intellectual property from Semiconductor Manufacturing International Corporation.
AlumiFuel Power Corporation said today that its wholly owned operating subsidiary, AlumiFuel Power, Inc., an early production stage hydrogen generation company, has announced new breakthroughs in its AlumiFuel powdered aluminum mixes for specific applications as a result of nanotechnology materials analysis made possible by its membership in Drexel University's Nanotechnology Consortium and the resultant direct interaction with the Drexel Nanotechnology Institute.
API Nanotronics Corp., a leading supplier of electronic systems and sub-systems, components, nano-optics and nanotechnology products to the aerospace, defense and communications sectors today announced an $800,000 order for its NanoOpto division. This order represents the largest order to date for NanoOpto, validating its business strategy in the nano space.
Professor Pierre Carreau, Director of the Center for Applied Research on Polymers and Composites (CREPEC) at the Ecole Polytechnique of Montreal, will present a web seminar on the ?Rheological characterization of polymer nanocomposites? on 12 August 2009.
Arrowhead Research Corporation today announced that it has completed the first phase of a plan to increase its ownership in electronics films subsidiary, Unidym Inc., a strategy that was initially announced at its annual shareholder meeting on March 26, 2009.
EV Group today announced a joint effort with Applied Materials, Inc. to develop wafer bonding processes for the manufacture of through-silicon vias in three-dimensional integrated circuit packaging applications.
Veeco Instruments Inc. announced today that it has completed a transaction to purchase certain assets of DayStar Technologies, Inc., in order to accelerate its penetration of the rapidly growing copper, indium, gallium, selenium (CIGS) solar market.
New inkjet method relies on FUJIFILM Dimatix Materials Printer to create inexpensive, portable sensors capable of detecting harmful substances that can cause food poisoning or be used for bioterrorism.