New inkjet method relies on FUJIFILM Dimatix Materials Printer to create inexpensive, portable sensors capable of detecting harmful substances that can cause food poisoning or be used for bioterrorism.
In close cooperation with leading research scientists, Leica Microsystems has optimized its confocal and two photon platform Leica TCS SP5 II for today's and future challenging requirements in life science research.
Applied Materials, Inc. today announced that its Applied SEMVision G4 Defect Analysis platform has been honored with the prestigious Editors' Choice Best Product Award by Semiconductor International (SI) magazine.
Responding to emerging opportunities in the U.S. solar market as well as economic stimulus funding, SVTC Technologies and Roth & Rau have renewed and expanded their partnership and are establishing a 30 megawatt (MW) world-class photovoltaic development and manufacturing center located in California's Silicon Valley in the City of San Jose
Members of the international EMC3D semiconductor equipment and materials consortium today announced they will extend the life of the joint agreement to July 2011 from an original closing date of October 2009.
Strem Chemicals, Inc, a manufacturer of specialty chemicals for research and development, announced that it has signed an exclusive agreement with Catalyx Nanotech to make Stacked Graphene NanoFibers available for R&D purposes.
NetLogic Microsystems, Inc., a leader in the design and development of knowledge-based processors and high-speed integrated circuits, and Taiwan Semiconductor Manufacturing Company (TSMC) today announced their collaboration on the industry-leading 40nm-G semiconductor process technology for NetLogic Microsystems' next-generation advanced knowledge-based processors and 10/40/100 Gigabit Ethernet physical layer solutions.
SAFC Hitech, a business segment within SAFC, a member of the Sigma-Aldrich Group, today announced details of its new materials roadmap for Metalorganic Chemical Vapor Deposition (MOCVD) and Atomic Layer Deposition (ALD) processes on silicon semiconductor substrates.
Cadence Design Systems, Inc., a leader in global design innovation, announced today that Hitachi has fully implemented a chip design in excess of 50 million gates in just five weeks using the Cadence Encounter Digital Implementation System.
Ambios Technology, Inc. introduced its newest instrument for characterization of surface morphology at the nanoscale. The new AFP-200 is a unique high-resolution surface measurement and analysis system that combines the ease of use of a stylus and optical profiler with the precision and resolution of a scanning probe microscope.
Keithley Instruments, Inc., a world leader in advanced electrical test instruments and systems, has created an application-specific microsite for those responsible for characterizing solar/photovoltaic devices.