Olympus Integrated Technologies America, Inc. announces that it has provided an infrared inspection and defect review system with metrology software to SEMATECH, the global consortium of semiconductor manufacturers, for its 3D R+D Center at the College of Nanoscale Science and Engineering's Albany NanoTech Complex.
Applied Materials, Inc., the world's largest supplier of solar photovoltaic manufacturing equipment, will showcase its strategy to make solar power affordable for everyone, everywhere, at the Intersolar North America event in San Francisco next week.
Optomec, Inc. and Vertical Circuits, Inc. announced today that they are collaborating in the development of a high density 3-dimensional interconnect solution that will enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance Multi-Chip Packages.
JSC SITRONICS, a leading provider of telecommunications, information technology and microelectronic solutions in Russia and the CIS, with a growing presence in other EEMEA emerging markets, has announced its intention to commence the construction of 90 nanometre microchip production facilities, in cooperation with the Russian Corporation of Nanotechnologies.
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that SEMATECH, the global consortium of chipmakers, has selected EVG's fully automated 300-mm GEMINI wafer bonder for enabling next-generation TSV and 3D interconnects.
Alchimer S.A., a leading provider of cost-saving coating processes for interconnections in advanced 3D-packaging applications, announced today that its cost-saving AquiVia deposition process is ready for implementation
Nanovea's White Light 3D Non-Contact Profilometers can precisely measure glass surfaces, light absorbing materials and wafer bowing with superior accuracy and speed. Measurement capabilities are flexible enough to provide accuracies to measure glass roughness less than 10nm.
Nanobiotix, an emerging nanomedicine company, announced today that preclinical follow-up data regarding long-term toxicity evaluation suggests that its patented NBTXR3 nanoparticles are designed to be a safe and effective treatment for radiosensitive and radioresistant tumors.
Applied Nanotech Holdings, Inc. announced that it has entered into an exclusive worldwide license agreement with a leading industrial chemical products company in Japan for manufacturing and commercializing nano-copper inks and pastes.
Neuftec Limited, the proprietor of a new, highly successful technology producing greener diesel announced today that Oxonica has failed in their challenge to a High Court ruling that upheld Neuftec's license rights in a dispute with Oxonica Energy Limited.
Cadence Design Systems, Inc., a leader in global design innovation, announced today the Japanese semiconductor research consortium STARC (Semiconductor Technology Academic Research Center), has integrated the Cadence® Encounter Digital Implementation System, with its integrated DFM technologies, as its DFM flow targeting 45 nanometer designs and below.
Silicon Frontline Technology, Inc. announced today that its 3D extraction software for post-layout verification, F3D (Fast 3D), has been validated by semiconductor foundry United Microelectronics Corporation, a leading global semiconductor foundry, for UMC's 40 and 65nm processes.