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New Dense ULK Materials More Reliable, Easier to Integrate than Porous Alternatives

Novellus has developed Dense ultra low dielectric constant (ULK) films that provide more reliable device integration compared to porous ULK alternatives. These films are deposited using a novel, single precursor that offers a five percent lower effective dielectric constant (k-effective) when combined with Novellus' diffusion barrier layers for typical 32nm device structures.

Posted: Jun 18th, 2009

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NEC and Toshiba Join Join IBM's 28nm Low-Power ProcessTechnology Alliance

IBM Corporation, NEC Electronics Corporation and Toshiba Corporation announced that NEC Electronics and Toshiba have extended technology development agreements with IBM to participate in the development of a 28-nanometer, high-k metal gate (HKMG), low-power chip technology geared for consumer products.

Posted: Jun 18th, 2009

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EPA Awards Contract to Study the Environmental Impacts of Nanotechnology

The Shaw Group Inc. today announced its Environmental & Infrastructure Group has been awarded a fifth consecutive contract by the U.S. Environmental Protection Agency (EPA) to provide operations support and research services for the Test and Evaluation facility and other National Risk Management Research Laboratory facilities.

Posted: Jun 17th, 2009

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Optical Metrology Technology Providers Enter Strategic Business Partnership

Nanometrics Incorporated and Zygo Corporation, each leading providers of optical metrology technologies to the global semiconductor and related industries, today announced that Nanometrics has purchased inventory and certain other assets relating to ZYGO?s Semiconductor Solutions business and that the two companies have entered into a supply agreement.

Posted: Jun 17th, 2009

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