OrthoMEMS, a medical device company focused on biomedical applications of patented MEMS and wireless technology, today announced that it has been granted an exclusive option from Cleveland Clinic to expand its license to include all fields of use.
QD Vision, developer of nanotechnology-based products for lighting and displays, today announced it has been awarded a Small Business Innovation Research (SBIR) Phase II contract by the U.S. Army as part of its Night Vision and Electronic Sensors Directorate.
Luxtera, a provider of Silicon CMOS Photonics, announced its collaboration with Freescale Semiconductor as its foundry source to achieve production of the world's first commercial Silicon CMOS Photonics semiconductor manufacturing process.
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has launched an all-new EVG501 wafer bonding system to address rising cost burdens for its university and R+D customers.
Picosun Oy, Finland-based global manufacturer of state-of-the-art Atomic Layer Deposition (ALD) systems, organizes its first ever World Forum in the Greater Helsinki area of Finland from June 9th to 10th.
nanoTox, the first company to provide complete risk assessment exclusively for nanoparticles, announced today that Governor George Allen of Virginia has joined the board of its parent company, Nano Risk Assessment, Inc.
FRT presents a new optical film thickness measuring tool at this year's Laser 2009 in Munich. The new MicroSpy FT non-destructively measures coatings that transparent or semi-transparent in the visible and near-infrared spectrum of light.
During a meeting at the St. Petersburg Economic Forum, Anatoly Chubais, RUSNANO CEO, and Vyacheslav Shtyrov, President of Republic of Sakha (Yakutia), decided to include OJSC Republican Investment Company (RIC) as a co-investor for the project titled Solid-State Lighting: New Generation of Environmentally Friendly and Energy Efficient Nanotechnology-Based Lighting.