Synopsys, Inc. today announced that Semiconductor Manufacturing International Corporation has adopted Synopsys' HSPICE circuit simulator and WaveView Analyzer for design and verification of their 65-nanometer and 45-nm IP blocks, I/O circuitry and standard cell characterization flows.
The Joint School of Nanoscience and Nanoengineering of North Carolina A+T State University and the University of North Carolina at Greensboro has chosen Carl Zeiss SMT to be the supplier of a state-of-the-art suite of advanced charged-particle-beam microscopes.
AIXTRON AG announced today that the Institute of Semiconductors of The Chinese Academy of Sciences, located in Beijing, PR China, has placed an order for one Close Coupled Showerhead 3x2 inch MOCVD system.
Cadence Design Systems, Inc. today announced that the Chinese Academy of Sciences Institute of Computing Technology has adopted the Cadence Incisive Xtreme III System for accelerating the development of RTL design with a verification flow for its next-generation 64 million-plus gates Loongson III advanced multi-core microprocessor.
Industrial Nanotech, Inc. today announced that the Company has initiated an ongoing program to educate heavy industry on specific uses of the Company?s patented Nansulate energy saving and asset protection coatings.
Schiltron Corporation, a 3-D Flash startup company, has partnered with Entrepix, Inc., a leading provider of CMP equipment and services for semiconductor and other advanced materials, to develop a method to manufacture 3-D Flash using existing materials, tools and processes, thus enabling a straightforward path to volume scale up.
The Flexible Display Center at Arizona State University and Universal Display Corporation today introduced the first a-Si:H active matrix flexible organic light-emitting diode (OLED) display to be manufactured directly on DuPont Teijin's polyethylene naphthalate substrate.
Applied Materials, Inc. today launched its Applied Endura CuBS RFX PVD system, the only copper barrier/seed deposition technology qualified for 32 and 22nm production by logic and flash memory manufacturers.