Entegris, Inc., a leader in contamination control and materials handling technologies for highly advanced manufacturing environments, and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.
Contact Resonance (CR) enables high resolution, quantitative imaging of both elastic storage modulus and viscoelastic loss modulus. The technique is particularly well suited for characterizing moderate to high modulus materials in the range of about 1GPa to 200GPA for materials such as composites, thin films, biomaterials, polymer blends, and even ceramics and metals.
Quantum Materials announced today it has shipped Tetrapod Quantum Dots in sample quantities to a diversified leading Asian-based electronics manufacturer. Quantum Materials recently developed tetrapod quantum dots to meet the client's performance specifications.
Azaya Therapeutics Inc., a clinical-stage oncology company developing more effective cancer treatments through its nanotechnology platform, announced an exclusive license with CANbridge Life Sciences, in Beijing, China, to develop and commercialize Azaya's lead compound, ATI-1123, for non-small cell lung cancer in China, South Korea and Taiwan.
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced the completion of the second annual eBeam Initiative survey. 28 member companies from across the photomask supply chain participated in the survey.
Grafoid Inc. announced today the formation of Calevia Inc., a joint venture partnership with ProScan RX Pharma Inc. to develop an entirely new graphene-based nanotechnology platform for the precise targeting and thermal eradication of solid cancer tumors.
Available on the EVG100 series of resist processing systems, the new NanoFill process provides void-free via filling of very deep trenches and high-aspect ratio structures, and is suitable for all common polymeric dielectrics - offering a highly flexible, low-cost and production-ready via-fill platform for interposer development for 3D-integrated image sensors and other device types.