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Asylum Research Introduces Contact Resonance Viscoelastic Mapping Mode: Quantitative Nanomechanical Imaging of Both Elastic and Loss Moduli

Contact Resonance (CR) enables high resolution, quantitative imaging of both elastic storage modulus and viscoelastic loss modulus. The technique is particularly well suited for characterizing moderate to high modulus materials in the range of about 1GPa to 200GPA for materials such as composites, thin films, biomaterials, polymer blends, and even ceramics and metals.

Posted: Sep 13th, 2013

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EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging

Available on the EVG100 series of resist processing systems, the new NanoFill process provides void-free via filling of very deep trenches and high-aspect ratio structures, and is suitable for all common polymeric dielectrics - offering a highly flexible, low-cost and production-ready via-fill platform for interposer development for 3D-integrated image sensors and other device types.

Posted: Sep 4th, 2013

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