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New Modeling and Library-Generation Package to Meet Optical Critical Dimension Metrology Requirements for the 32nm Node and Below

Developed as part of a cooperative agreement between KLA-Tencor and Timbre Technologies, Inc., this new software package leverages the strength of the two industry leaders to enable metrology engineers in IC fabs to measure the dimensions of 3D logic and memory structures, such as FinFETs , bulb RCATs, and structures created by the advanced patterning technique called spacer pitch splitting.

May 12th, 2009

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