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QD Vision, developer of nanotechnology-based products for lighting and displays, today announced it has been selected by the Department of Energy (DoE) to receive more than $700,000 in funding for a project that will significantly contribute to the development of enhanced solid state lighting technologies.
Posted: Apr 20th, 2009
Read moreARM today announced the availability of the industry's most comprehensive IP platform for TSMC's 40nm G manufacturing process.
Posted: Apr 20th, 2009
Read moreSunfilm, AG and Applied Materials, Inc., today announced that the world's first tandem junction SunFab Thin Film Line installed at Sunfilm's Grossroehrsdorf facility achieved factory acceptance on April 14, 2009.
Posted: Apr 20th, 2009
Read moreEarly Warning today displayed its Biohazard Water Analyzer which offers the next generation in microbial testing. Using a unique combination of advanced technologies, the Analyzer goes beyond lab culturing of indicator coliforms and directly measures individual species of pathogenic bacteria, protozoa and viruses in the same test.
Posted: Apr 17th, 2009
Read moreGrace Semiconductor Manufacturing Corporation, one of the leading semiconductor foundries in China, announced delivery of its advanced 0.18 micron RFCMOS process design kit through an exclusive 0.18 micron RFCMOS collaboration with Sentinel IC Technologies.
Posted: Apr 17th, 2009
Read moreThe Fibermetric system from FEI delivers statistically valid data in minutes to improve fiber and filter material development and manufacturing.
Posted: Apr 17th, 2009
Read moreEnable IPC Corporation today announced that the cover story of the April 2009 edition of the American Ceramic Society Bulletin features Enable IPC's SolRayo subsidiary.
Posted: Apr 16th, 2009
Read moreAuterra, Inc. announced today it has completed the process of changing its name from Applied NanoWorks.
Posted: Apr 16th, 2009
Read moreNanosurf today announced it will showcase the successor model to the world's best-selling Phase-Locked Loop (PLL) Detector and Controller at the NC-AFM Conference, September 2009, Yale, USA.
Posted: Apr 16th, 2009
Read moreSEMATECH, a global consortium of chipmakers, announced today that Canon ANELVA Corporation, a leading manufacturer of semiconductor equipment, has joined its Front End Processes (FEP) Program.
Posted: Apr 16th, 2009
Read moreGreen Energy Technology Inc., Ltd. (GET) has certified its SunFab Thin Film Line, supplied by Applied Materials, Inc., for the production of Taiwan?s largest solar photovoltaic panels.
Posted: Apr 16th, 2009
Read moreIn a move that signals a firm and ongoing commitment to advanced semiconductor technology leadership, IBM, Chartered Semiconductor Manufacturing Ltd., GLOBALFOUNDRIES, Infineon Technologies, Samsung Electronics, Co., Ltd., and STMicroelectronics have defined and are jointly developing a 28-nanometer (nm), high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process technology.
Posted: Apr 16th, 2009
Read moreMicronic Laser Systems AB and ASML Netherlands B.V. signed in December 2004 a license agreement giving ASML the right to market optical maskless lithography for semiconductor applications based on Micronic's patent portfolio in the SLM (Spatial Light Modulator) and data path technology. ASML has terminated its licenses.
Posted: Apr 16th, 2009
Read moreThis large order comprises multiple plasma etch, deposition and growth systems.
Posted: Apr 16th, 2009
Read moreReactive NanoTechnologies, Inc., developer and manufacturer of its patented NanoFoil, announced that it has developed a bonding solution using NanoBond for ruthenium sputtering targets bonded to metal backing plates that does not require the use of backside metallization.
Posted: Apr 15th, 2009
Read moreThe Supervisory Council of Russian Corporation of Nanotechnologies has approved the Corporation's participation in the project aimed at organizing the industrial production of pre-pregs composed of carbon or mineral fibers impregnated with nano-filled bonding agent.
Posted: Apr 15th, 2009
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