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EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging

Available on the EVG100 series of resist processing systems, the new NanoFill process provides void-free via filling of very deep trenches and high-aspect ratio structures, and is suitable for all common polymeric dielectrics - offering a highly flexible, low-cost and production-ready via-fill platform for interposer development for 3D-integrated image sensors and other device types.

Sep 4th, 2013

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