Cadence Design Systems, Inc. said today that its Cadence Encounter Digital Implementation System for advanced RTL-to-GDSII chip design has enabled STMicroelectronics to equip their worldwide design teams with 65- and 40- nanometer production flows that provide industry leading performance and capacity for multi-million instance, high-performance SoC designs in the consumer, computer peripherals and wireless markets.
Ultra Clean Technology and FEI Company announced today they have signed a Global Supplier Agreement under which Ultra Clean will provide hosted manufacturing services in the FEI Hillsboro, Oregon facility.
Selah Technologies announced today that the company has committed to join the In-Depth portion of the Nanoscale Materials Stewardship Program (NMSP) administered by the U.S. Environmental Protection Agency.
EV Group today announced that leading Korean components manufacturer, Samsung Electro-Mechanics Co., selected the company's EVG810LT, a LowTemp plasma activation system, for its R+D work involving stacked and 3D MEMS devices.
mPhase Technologies, Inc. today announced that a recent breakthrough that will allow the company to produce their Smart NanoBattery with a much greater cost efficiency has successfully passed rigorous testing.
AIXTRON AG and Ovonyx, Inc. today announced an agreement to cooperate on the qualification of Atomic Vapor Deposition (AVD) process technology to further advance scaling of next-generation phase change memory products.
Celerity, Inc. announced today the introduction of its new GF100 series mass flow controller designed to precisely measure, monitor and control ultra high purity process gas chemistry in semiconductor device and solar cell manufacturing processes.
Specialty coatings company, AeonClad Coatings LLC, has announced the launch of a newly formed subsidiary, AeonClad Biomedical LLC. The new company will focus on biomedical applications utilizing the AeonCoat Technology.