Applied Materials, Inc. announced today that both the single and tandem junction solar photovoltaic modules produced by its SunFab Thin Film Line have met the stringent requirements of the International Electrotechnical Commission standards 61646 and 61730, certifying that these modules will meet performance and safety specifications under challenging environmental conditions.
Hybrid Plastics, Inc., together with the local Area Development Partnership (ADP) and Mississippi's Manufacturing Extension Partnership (MEP), won the 2008 Best Special Event Award for its Advanced Nanomaterials Symposium from the International Economic Development Council.
Roth + Rau AG and Innovalight have completed the installation of the world's first silicon-ink based solar cell production line. This first pilot manufacturing line has been built and installed at Innovalight, in Sunnyvale, California and has been qualified to operational capability over the last two months of 2008.
According to a new report available at Electronics.ca Publications, worldwide nanotechnology lithium-ion batteries are poised to achieve significant growth as units become smaller and less expensive broadening the types of energy applications.
Led by Dr. Barbara D. Beck and Dr. Christopher M. Long, Gradient?s Nanotechnology Risk practice is experienced in addressing the potential human health and ecological impacts of engineered nanomaterials.
Evogen, Inc., a global molecular diagnostics company, and LGC, an international science-based company and recognised provider of laboratory services and measurement standards, announced today that they have signed a worldwide license agreement of LGC's HyBeacons PCR probe chemistry technology to Evogen to augment the recently launched rapid molecular diagnostics and detection platform.
S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced today that they will collaborate with IMEC, one of Europe's leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T.'s Flip Chip bonder equipment.