Led by Dr. Barbara D. Beck and Dr. Christopher M. Long, Gradient?s Nanotechnology Risk practice is experienced in addressing the potential human health and ecological impacts of engineered nanomaterials.
Evogen, Inc., a global molecular diagnostics company, and LGC, an international science-based company and recognised provider of laboratory services and measurement standards, announced today that they have signed a worldwide license agreement of LGC's HyBeacons PCR probe chemistry technology to Evogen to augment the recently launched rapid molecular diagnostics and detection platform.
S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced today that they will collaborate with IMEC, one of Europe's leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T.'s Flip Chip bonder equipment.
Aspen Aerogels Inc. and Samsung America Inc. have signed a cooperative sales agreement under which Samsung will market and sell Aspen Aerogels' thermal insulation products to the concentrated solar thermal industry in the U.S. and Europe.
Rudolph Technologies, Inc., a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, introduces Discover Solar - the first fab management software tool designed specifically to help photovoltaic manufacturers increase cell efficiency and reduce costs.
WaferGen Biosystems, Inc. today announced that academic researchers have successfully demonstrated the performance of the company?s SmartChip Real-Time PCR System in the initial phase of the platform?s ongoing alpha testing program.
Installed in the existing process line, the new electron-beam lithography system is required for the development of state-of-the-art electronic and opto-electronic high-power devices based on GaAs and GaN. Additionally, the Vistec SB250 will be used as an in-house mask writer.
E-beam supplier Vistec, along with semiconductor research group CEA/Leti, and emerging design and software company D2S, today announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for the 45- and 32-nm nodes.
Cadence Design Systems announced today that Fujitsu Microelectronics Limited has taped out a 65nm mobile WiMAX design using Fujitsu Reference Design Flow 3.0, which includes Common Power Format (CPF) enabled Cadence Low-Power technologies.