Rudolph Technologies, Inc., a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, today announced the shipment of its new Explorer Inspection Cluster to a major chip manufacturer located in Japan.
Konarka Technologies, Inc., an innovator in development and commercialization of Power Plastic, a material that converts light to energy, today announced Germany?s Federal Ministry of Education and Research (BMBF) is supporting a future oriented development project through a consortium that is headed by Konarka, and is providing funding of nearly EUR 2.5 million over the next three years.
Selah Technologies, an advanced materials manufacturer, announced today that the company has received a $100,000 SBIR Phase I grant from the National Science Foundation (NSF) to fund continued manufacturing and development activities for the company?s Selah Dots nanotechnology.
BioNanomatrix, Inc., a developer of breakthrough nanoscale platforms for molecular diagnostics, personalized medicine and biomedical research, today announced the appointment of Gary Zweiger, Ph.D., as vice president of business development.
Applied Materials, Inc. today unveiled its Applied Centura Enabler E5 dielectric etch system, the industry?s most advanced solution for creating the 40:1 high aspect ratio contact features that are critical to the yield and performance of 32nm and below DRAM and Flash memory chips.
Agar Scientific is pleased to announce the immediate appointment of Steve Woodland as Managing Director with current MD, Dr Lynne Joyce moving to a new role as Director of Market Development where she will focus on technology, product development and customer relationships.
ConocoPhillips and the University of Kansas (KU) today announced a three-year collaborative nanotechnology research program which will focus on the development and testing of new technologies for oilfield stimulation to enhance recovery to help meet growing energy demand.
According to the World Fab Forecast report, recently released by SEMI, worldwide fab capacity is expected to grow by five percent in 2008 and is currently expected to increase between four and five percent in 2009.
Oxford Instruments Plasma Technology has announced that it has recently won an order from a leading manufacturer of HB-LEDs for three Plasmalab System133 ICP380 plasma etch tools for use in High Brightness LED (HB-LED) manufacturing.