According to the World Fab Forecast report, recently released by SEMI, worldwide fab capacity is expected to grow by five percent in 2008 and is currently expected to increase between four and five percent in 2009.
Oxford Instruments Plasma Technology has announced that it has recently won an order from a leading manufacturer of HB-LEDs for three Plasmalab System133 ICP380 plasma etch tools for use in High Brightness LED (HB-LED) manufacturing.
The new Nanochemistry Laboratory is located at the Institut de Science et d?Ingenierie Supramoleculaires (ISIS) of the University of Strasbourg, France and will work closely with Strem?s U.S. facility. The goal of the new facility will be to serve R+D groups worldwide with custom-made nanostructured materials.
Applied Materials, Inc. today announced that it is leading a major effort to enable the widespread adoption of through-silicon vias, a rapidly-emerging approach for vertically stacking integrated circuits to boost chip performance and functionality in a smaller area.
Soligie, a market leader in the design and manufacture of Printed Electronics, and Acreo, a leading Swedish research institute, announced today that they have entered into an agreement for the development and volume manufacturing of Acreo?s printed electrochromic display technology, PaperDisplay.
SiGNa Chemistry, Inc., a developer of stabilized reactive metals for safer, more efficient industrial chemistry, today announced a major expansion of its central process development laboratory in Monmouth Junction, New Jersey.
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the NT series -- a new, yet already field-proven suite of mask aligners, wafer-to-wafer bond aligners and measurement systems -- to address increased demand for higher precision alignment accuracy.
Cambridge NanoTech, a leader in Atomic Layer Deposition (ALD) science and equipment for research and industry, today announced that it has expanded its leadership team with the promotion of Dr. Ganesh Sundaram to Vice President of Technology and Roger Coutu to Vice President of Engineering.
Applied Materials, Inc. today announced its Applied Aera2 for Lithography system. Using the system?s IntenCD technology in the fab, semiconductor manufacturers can improve wafer critical dimension uniformity by more than 20%, increasing device yield and lowering the per-wafer cost of patterning.