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Enhanced wafer alignment metrology capability coupled with market-leading GEMINI FB system creates closed-loop fusion wafer bonding solution to enable high-density TSV devices.
Posted: Jul 8th, 2013
Read moreBioNano Genomics and the New York Genome Center (NYGC) announced today a strategic partnership between the two institutions.
Posted: Jul 8th, 2013
Read moreApplied Materials, Inc. today announced a suite of new defect review and classification technologies for its market-leading SEMVision family of products to accelerate time to yield for leading-edge chip manufacturing at 1X-nm and beyond.
Posted: Jul 8th, 2013
Read moreNew NMOS epitaxy deposition process is essential for faster transistors inside next-generation mobile processor chips. NMOS epitaxy boosts transistor speed by the equivalent of half a device node without increasing off-state power consumption.
Posted: Jul 8th, 2013
Read moreLayTec announced its cooperation with Meyer Burger, a global technology group specializing in systems, product equipment and services along the photovoltaic value chain including the manufacturing processes for wafers, solar cells, solar modules and solar systems. Combined efforts of both companies resulted in the world's first fully integrated EVA cross-linking metrology solution for PV module production lines.
Posted: Jul 4th, 2013
Read moreThe President of the Russian Union of Chemists Viktor Ivanov and Chief Executive Officer of the Fund for Infrastructure and Educational Programs Andrew Swinarenko signed an agreement on the promotion of the production and implementation of nanotechnology at chemical enterprises.
Posted: Jul 3rd, 2013
Read moreNanosphere, Inc., a leader in the development and commercialization of advanced molecular diagnostics systems, announced publication of a prospective, multicenter study that illustrates the high diagnostic accuracy and potential clinical impact of the company's FDA-cleared Verigene Gram-Positive Blood Culture Test in the peer-reviewed, open-access journal PLOS Medicine.
Posted: Jul 3rd, 2013
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The NX-HDM system sets a new standard for the industry in automatic defect review AFM technology by increasing throughput up to 1000 percent and an offering of 30% higher success rate than prior system, analyzing, identifying and scanning media for all wafer sizes up to 150mm.
Posted: Jul 3rd, 2013
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Parallel precision positioning specialist PI (Physik Instrumente) recently added a new building with more production floors, metrology labs and R+D office space to its factory in Karlsruhe, Germany.
Posted: Jul 2nd, 2013
Read moreUltra transparent conducting oxides for improved solar cell efficiency.
Posted: Jul 2nd, 2013
Read moreDesigned to advance 'more-than-Moore' breakthrough technologies, library provides nearly 3X the number offered by traditional foundries.
Posted: Jul 1st, 2013
Read moreThree high-volume-production room-temperature debonding process types are supported by a supply chain of seven qualified adhesive suppliers to enable greater manufacturing flexibility.
Posted: Jul 1st, 2013
Read moreLinde Electronics launched a revolutionary new carbon nanotube ink to drive innovation in the development of next generation displays, sensors and other electronic devices.
Posted: Jun 28th, 2013
Read morePlastic Logic will work with Cambridge researchers on a specific programme which aims to exploit graphene, related two dimensional materials and hybrid systems in flexible, plastic electronics.
Posted: Jun 26th, 2013
Read moreAmerican Graphite Technologies Inc. announces it has received independent test results in regard to its project with CTI Nanotechnologies LLC.
Posted: Jun 26th, 2013
Read moreFirst collaboration milestone speeds validation of IP and design correlation on UMC's 14-nm FinFET process.
Posted: Jun 26th, 2013
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