Leti and EV Group Launch a Common Lab On Wafer Bonding Technologies
Projects target more efficient 3D TSV integration and covalent bonding at room temperature.
Jul 10th, 2013
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SEMATECH and Air Products Work Together to Accelerate Advanced Materials for the Semiconductor Industry
SEMATECH today that Air Products, a global industrial gas and technology leader, has joined its Front End Processes (FEP) program, and will work with SEMATECH to assess advanced materials and technologies for the development of sub-10 nm node III-V devices.
Jul 10th, 2013
Read moreAzaya Therapeutics Launches Parexo Labs, Offering Liposomal Manufature And Nanotechnology Testing Services To Drug And Device Developers
Azaya Therapeutics Inc., an oncology company focused on developing more effective cancer treatments through its nanotechnology platform, announced the launch of a new division, Parexo Labs, a contract development and manufacturing organization providing chemical testing and liposomal manufacturing services to outside organizations.
Jul 9th, 2013
Read moreCadence Solutions Enable Successful Tape Out of 20-Nanometer SoC Test Chip by Global Unichip
Cadence Design Systems today announced that the design services company, Global Unichip Corporation, utilized the Cadence Encounter Digital Implementation System and Cadence Litho Physical Analyzer to successfully complete the tape out of a 20nm system-on-a-chip test chip.
Jul 9th, 2013
Read moreKLA-Tencor Announces New Additions to its Defect Inspection and Review Portfolio
Coupling electron-beam review with optical inspection facilitates rapid defect discovery, identification and sourcing.
Jul 9th, 2013
Read moreDow Corning Joins imec to Advance Enabling Technologies for 3D IC Semiconductor Packaging
The announcement signals expanded opportunities for both organizations to combine their expertise toward the development and broader adoption of 3D integrated circuit (IC) packaging technologies, wherein IC chips are stacked in vertical 3D architectures.
Jul 8th, 2013
Read moreEV Group Pushes the Limits on 3D-IC Manufacturing for Next-Generation CMOS Image Sensors
Enhanced wafer alignment metrology capability coupled with market-leading GEMINI FB system creates closed-loop fusion wafer bonding solution to enable high-density TSV devices.
Jul 8th, 2013
Read moreBioNano Genomics and New York Genome Center Enter Into a Strategic Collaboration
BioNano Genomics and the New York Genome Center (NYGC) announced today a strategic partnership between the two institutions.
Jul 8th, 2013
Read moreApplied Materials' Next-Generation Defect Review and Classification Technology, Improves Yield for Complex 3D Transistors, 1X Nanometer Nodes
Applied Materials, Inc. today announced a suite of new defect review and classification technologies for its market-leading SEMVision family of products to accelerate time to yield for leading-edge chip manufacturing at 1X-nm and beyond.
Jul 8th, 2013
Read moreApplied Materials Unveils New Epitaxy Technology for High-Performance Transistors
New NMOS epitaxy deposition process is essential for faster transistors inside next-generation mobile processor chips. NMOS epitaxy boosts transistor speed by the equivalent of half a device node without increasing off-state power consumption.
Jul 8th, 2013
Read moreMeyer Burger And LayTec Announce Cooperation
LayTec announced its cooperation with Meyer Burger, a global technology group specializing in systems, product equipment and services along the photovoltaic value chain including the manufacturing processes for wafers, solar cells, solar modules and solar systems. Combined efforts of both companies resulted in the world's first fully integrated EVA cross-linking metrology solution for PV module production lines.
Jul 4th, 2013
Read moreUnion of Chemists and RUSNANO to develop nanotechnology in the chemical industry
The President of the Russian Union of Chemists Viktor Ivanov and Chief Executive Officer of the Fund for Infrastructure and Educational Programs Andrew Swinarenko signed an agreement on the promotion of the production and implementation of nanotechnology at chemical enterprises.
Jul 3rd, 2013
Read moreStudy Demonstrates Accuracy and Potential Clinical Impact of Nanosphere's Verigene Gram-Positive Blood Culture Test
Nanosphere, Inc., a leader in the development and commercialization of advanced molecular diagnostics systems, announced publication of a prospective, multicenter study that illustrates the high diagnostic accuracy and potential clinical impact of the company's FDA-cleared Verigene Gram-Positive Blood Culture Test in the peer-reviewed, open-access journal PLOS Medicine.
Jul 3rd, 2013
Read morePark Systems Introduces Park NX-HDM: Fully Automated Automatic Defect Review and Sub-Angstrom Surface Roughness for Hard Disk Media and Semiconductor Substrates
The NX-HDM system sets a new standard for the industry in automatic defect review AFM technology by increasing throughput up to 1000 percent and an offering of 30% higher success rate than prior system, analyzing, identifying and scanning media for all wafer sizes up to 150mm.
Jul 3rd, 2013
Read moreNew Manufacturing Capabilities for Precision Hexapod Positioners added by PI
Parallel precision positioning specialist PI (Physik Instrumente) recently added a new building with more production floors, metrology labs and R+D office space to its factory in Karlsruhe, Germany.
Jul 2nd, 2013
Read moreInnovnano's Nanostructured AZO Sputtering Targets; the Sustainable Replacement for ITO
Ultra transparent conducting oxides for improved solar cell efficiency.
Jul 2nd, 2013
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