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Tegal to Acquire Micromachining Product Lines and IP from Alcatel

Tegal Corporation today announced that it has signed an agreement with Alcatel Micro Machining Systems and Alcatel-Lucent to acquire their Deep Reactive Ion Etch (DRIE) and Plasma Enhanced Chemical Vapor Deposition (PECVD) products, and the related intellectual property, directed at advanced 3-dimensional wafer-level packaging applications.

Sep 2nd, 2008

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