Neah Power Systems, Inc., a leading developer of fuel cells for military, industrial and consumer portable electronic devices, announced today that it has created a strategic partnership with IceMOS Technology Ltd. to utilize the company as its starting substrate supplier.
Anasys Instruments has won the prestigious R+D 100 award for its new VESTA product, a tool which revolutionizes thermal analysis with its ability to perform 'point + click' micro and nano thermal analysis at the push of a button.
A new metal carbide Fischer-Tropsch (FT) catalyst developed by Oxford Catalysts looks set to make second-generation biofuel production using small-scale FT microchannel reactors environmentally and economically viable.
Under the agreement, Konica Minolta will be able to integrate Universal Display?s proprietary OLED technologies into Konica Minolta?s white OLED lighting products, thus securing Konica Minolta to accelerate commercialization and to strengthen the competitiveness of its white OLEDs.
Ener1, Inc., maker of advanced battery technology designed to power the next generation of hybrid and electric vehicles, strengthened its advantage in the lithium-ion battery race, by acquiring exclusive ownership of EnerDel, including essential manufacturing and intellectual property assets from former joint venture partner Delphi Automotive Systems.
Chief Technology Officer Dr. Stanley Levy delivered a key oral presentation at the SPIE Symposium on Solar Applications and Energy in San Diego today where he detailed the various scientific breakthroughs underlying the company's BioBacksheet product and its role in helping the photovoltaic industry drive the cost per kilowatt hour to lower levels.
Romania's National Institute of Materials Physics (NIMP) has ordered an advanced sputtering tool from Surrey NanoSystems, to support fundamental research into oxide materials including piezoelectric and pyroelectric thin films, and photoelectrochemical cells to support the hydrogen economy.
In collaboration with the National NanoFab Center (NNFC) in Daejeon, Korea and Stanford NanoFab (SNF) in Palo Alto, CA, BeSang Inc., a semiconductor company based in Beaverton, OR, has successfully developed a breakthrough three-dimensional (3D) integrated circuit (IC) technology, enabling low-cost memories and high-performance logic products with large embedded memory blocks.