In collaboration with the National NanoFab Center (NNFC) in Daejeon, Korea and Stanford NanoFab (SNF) in Palo Alto, CA, BeSang Inc., a semiconductor company based in Beaverton, OR, has successfully developed a breakthrough three-dimensional (3D) integrated circuit (IC) technology, enabling low-cost memories and high-performance logic products with large embedded memory blocks.
Henkel Corporation has introduced an energy saving, low-temperature cleaner, Bonderite Ridoline RT-153, designed to be compatible with both phosphate and phosphate-free conversion coating technologies.
Alfa Aesar has published a new High Purity Inorganics Catalog which lists over 1,000 high purity inorganic materials, including base metal compounds, rare earth compounds and ultra dry materials for air and moisture sensitive applications.
Olympus and Digital Surf have announced an agreement whereby Olympus will supply users of its LEXT OLS3100 confocal laser scanning microscope (cLSM) with 3D surface texture and micro-geometry analysis software based upon Digital Surf's Mountains technology.
Applied Materials, Inc. announced today that it has signed a five-year service contract with Green Energy Technology Inc. (GET) of Taiwan to support GET's Applied SunFab Thin Film Line for solar module manufacturing.
Applied Materials is advancing semiconductor research with an equipment and service donation to the University of California, Berkeley?s Nanofabrication Laboratory in the Center for Information Technology Research in the Interest of Society (CITRIS).