Picosun Oy, leading Atomic Layer Deposition (ALD) equipment manufacturer expands its central role in the field of European semiconductor manufacturing by taking part in a yet new international R&D project, Lab4MEMS.
This tradeshow will enable Arkema to showcase three innovations developed from its know-how in the nanostructuring of materials: the use at very low rates (around 100 ppm) of Graphistrength in thermoplastic matrices in order to enhance their mechanical performance, the new nanostructured Altuglas ShieldUp PMMA sheet, particularly resistant to impact, and Apolhya Solar, a transparent thermoplastic, also nanostructured, designed for the encapsulation of new generation photovoltaic modules.
Toshiba Corporation today announced the line-up of innovative technologies that it will bring to "nano tech 2013 - The 12th International Nanotechnology Exhibition & Conference", the world's biggest exhibition of nanotechnology.
At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks. The solution, based on Cadence Encounter Test technology, was verified on an industrial test chip containing a logic die and a JEDEC-compliant Wide-I/O Mobile DRAM.
Veeco Instruments Inc. announced today that the University of Waterloo has purchased a GEN10® Molecular Beam Epitaxy system for its recently opened Quantum-Nano Centre hosting the Waterloo Institute for Nanotechnology and the Institute for Quantum Computing.
Applied Nanotech Holdings, Inc. announced that Solexel presented its achievement of 20.62 percent efficiency from 156 mm x 156 mm full-square solar cell using its low cost ultra thin epitaxial silicon film and porous silicon lift-off technology at PV Asia Pacific.
Dolomite, a world leader in microfluidic design and manufacture, has introduced Multiflux-2, a new range of microfluidic connectors and interfaces offering unparalleled high density connection with 1.5 mm pitch between tubing lines for fast, reliable and precisely aligned connections between microfluidic chips, pumps, sensors, valves and other fluidic modules without disruptions to the fluid flow.